LT1965IMS8E#PBF Linear Technology, LT1965IMS8E#PBF Datasheet - Page 18

• Manufacturer Part Number: LT1965IMS8E#PBF
• Description: IC REG LDO 1.1A 8-MSOP
• Manufacturer: Linear Technology

Specifications of LT1965IMS8E#PBF

• Regulator Topology: Positive Adjustable
• Voltage - Output: 1.2 ~ 19.5 V
• Voltage - Input: 1.8 ~ 20 V
• Voltage - Dropout (typical): 0.31V @ 1.1A
• Number Of Regulators: 1
• Current - Output: 1.1A
• Current - Limit (min): 1.2A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
• Voltage Regulator Type: Linear
• Topology: LDO
• Regulator Output Type: Adjustable
• Polarity Type: Positive
• Number Of Outputs: Single
• Input Voltage (min): 1.8V
• Input Voltage (max): 20V
• Output Voltage: 1.2 to 19.5V
• Package Type: MSOP EP
• Output Current: 1.1A
• Load Regulation: 8mV
• Line Regulation: 8mV
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Dropout Voltage@current (max): 0.08@1mA/0.175@100mA
• Dropout Voltage@current (typ): 0.055@1mA/0.12@100mA
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LT1965 Series
PACKAGE DESCRIPTION
18
3.5 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
(.0165 ± .0015)
0.42 ± 0.038
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
GAUGE
PLANE
2.15 ±0.05
TYP
RECOMMENDED SOLDER PAD LAYOUT
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
5.23
MIN
GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.152mm (.006") PER SIDE
(.010)
0.254
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
2.794 ± 0.102
(.110 ± .004)
DETAIL “A”
0° – 6° TYP
2.38 ±0.05
(2 SIDES)
(.021 ± .006)
0.53 ± 0.152
(.0256)
2.083 ± 0.102
(.082 ± .004)
0.65
BSC
0.50 BSC
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.675 ±0.05
PACKAGE
OUTLINE
(.007)
0.18
(Reference LTC DWG # 05-08-1662)
(Reference LTC DWG # 05-08-1698)
8-Lead Plastic DFN (3mm × 3mm)
TOP MARK
8-Lead Plastic MSOP
EXPOSED PAD OPTION
(NOTE 6)
BOTTOM VIEW OF
PIN 1
MS8E Package
1
0.200 REF
8
DD Package
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
DETAIL “A”
(.081 ± .004)
2.06 ± 0.102
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
(.072 ± .004)
1.83 ± 0.102
ON TOP AND BOTTOM OF PACKAGE
SEATING
PLANE
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
0.00 – 0.05
TYP
(.043)
MAX
1.10
1.65 ± 0.10
(2 SIDES)
(.0256)
0.65
BSC
1
8
7 6 5
2 3
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
4
TYP
4
5
2.38 ±0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
0.52
REF
0.86
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8E) 0603
8
1
0.50 BSC
0.38 ± 0.10
(DD) DFN 1203
1965fa