LT1086IT#PBF Linear Technology, LT1086IT#PBF Datasheet - Page 11

• Manufacturer Part Number: LT1086IT#PBF
• Description: IC LDO REG ADJUSTABLE 1.5A TO220
• Manufacturer: Linear Technology

Specifications of LT1086IT#PBF

• Regulator Topology: Positive Adjustable
• Voltage - Output: 1.25 ~ 23.5 V
• Voltage - Input: 2.55 ~ 25 V
• Voltage - Dropout (typical): 1.3V @ 1.5A
• Number Of Regulators: 1
• Current - Limit (min): 1.5A
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: TO-220-3 (Straight Leads)
• Voltage Regulator Type: Linear
• Topology: LDO
• Regulator Output Type: Adjustable
• Polarity Type: Positive
• Number Of Outputs: Single
• Input Voltage (max): 25V
• Package Type: TO-220
• Output Current: 1.5A
• Power Dissipation: 15W
• Load Regulation: 0.3%
• Line Regulation: 0.2%
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Dropout Voltage@current (max): 1.5@1.5A
• Dropout Voltage@current (typ): 1.3@1.5A
• Pin Count: 3 +Tab
• Mounting: Through Hole
• Quiescent Current (max): 10mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Lead Free Status / Rohs Status: Compliant

In both cases the junction temperature is below the
maximum rating for the respective sections, ensuring
reliable operation.
Junction-to-case thermal resistance for the K and T pack-
ages is specified from the IC junction to the bottom of the
case directly below the die. This is the lowest resistance
path for heat flow. While this is also the lowest resistance
path for the H package, most available heat sinks for this
package are of the clip-on type that attach to the cap of the
package. The data sheet specification for thermal resis-
tance for the H package is therefore written to reflect this.
APPLICATIONS
TYPICAL APPLICATIONS
U
4.25V
TO 5.25V
1N5817
INFORMATION
U
+
V
IN
10 F
TANTALUM
U
6.5V
*REQUIRED FOR STABILITY
W
+
IN
LT1086-2.85
10 F
GND
IN
U
SCSI-2 Active Termination
5V, 1.5A Regulator
OUT
LT1086
ADJ
+
TERMPWR
OUT
10 F
TANTALUM
In all cases proper mounting is required to ensure the best
possible heat flow from the die to the heat sink. Thermal
compound at the case-to-heat sink interface is strongly
recommended. In the case of the H package, mounting the
device so that heat can flow out the bottom of the case will
significantly lower thermal resistance ( a factor of 2). If
the case of the device must be electrically isolated, a
thermally conductive spacer can be used as long as its
added contribution to thermal resistance is considered.
Note that the case of all devices in this series is electrically
connected to the output.
121
1%
365
1%
0.1 F
CERAMIC
18 TOTAL
+
10 F*
TANTALUM
5V AT 1.5A
LT1086 • AI02
110
110
110
2%
2%
2%
110
110
110
LT1086 • TA03
LT1086 Series
sn1086 1086ffs
11