MCP1726T-5002E/SN Microchip Technology, MCP1726T-5002E/SN Datasheet - Page 20

• Manufacturer Part Number: MCP1726T-5002E/SN
• Description: IC LDO REG 1A 5.0V 8SOIC
• Manufacturer: Microchip Technology

Specifications of MCP1726T-5002E/SN

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.22V @ 1A
• Number Of Regulators: 1
• Current - Output: 1A (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

MCP1726
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below:
As you can see from the result, this application will be
operating very near the maximum operating junction
temperature of 125°C. The PCB layout for this
application is very important as it has a significant
impact on the junction-to-ambient thermal resistance
(Rθ
in this application.
Maximum Package Power Dissipation at
70°C Ambient Temperature
From this table you can see the difference in maximum
allowable power dissipation between the 3x3 DFN
package and the 8-pin SOIC package. This difference
is due to the exposed metal tab on the bottom of the
DFN package. The exposed tab of the DFN package
provides a very good thermal path from the die of the
LDO to the PCB. The PCB then acts like a heatsink,
providing more area to distribute the heat generated by
the LDO.
DS21936C-page 20
3x3 DFN (41° C/W Rθ
8LD SOIC (150°C/Watt Rθ
JA
P
P
P
P
) of the 3x3 DFN package, which is very important
D(MAX)
D(MAX)
D(MAX)
D(MAX)
T
T
T
= (125°C – 70°C) / 41° C/W
= 1.34W
= (125°C – 70°C)/ 150° C/W
= 0.366W
J
J
J
=
=
=
JA
)
T
48.8°C + 70.0°C
118.8°C
JRISE
JA
)
+ T
A(MAX)
© 2007 Microchip Technology Inc.