TC1263-3.3VOA Microchip Technology, TC1263-3.3VOA Datasheet - Page 5

• Manufacturer Part Number: TC1263-3.3VOA
• Description: IC REG LDO 3.3V 500MA 8SOIC
• Manufacturer: Microchip Technology

Specifications of TC1263-3.3VOA

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.35V @ 500mA
• Number Of Regulators: 1
• Current - Output: 500mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 6 V
• Output Voltage: 3.3 V
• Output Type: Fixed
• Dropout Voltage (max): 650 mV
• Output Current: 500 mA
• Line Regulation: 0.05 %
• Load Regulation: 0.002 % / mA
• Voltage Regulation Accuracy: 0.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: TC12633.3VOA

4.0
4.1
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
(T
(θ
EQUATION 4-2:
Table 4-1 and Table 4-2 show various values of θ
the TC1263 packages.
TABLE 4-1:
*Pin 2 is ground. Device is mounted on topside.
©
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
225 sq mm
100 sq mm
(Topside)*
A
JA
J
2002 Microchip Technology Inc.
MAX
MAX
Copper
I
Where:
LOAD
).
V
Area
V
OUT
), the maximum allowable die temperature
) and the thermal resistance from junction-to-air
IN
Where all terms are previously defined.
MAX
THERMAL CONSIDERATIONS
Thermal Shutdown
Power Dissipation
MAX
MIN
P
D
P
= Worst case actual power dissipation
= Maximum voltage on V
= Minimum regulator output voltage
= Maximum output (load) current
D
2500 sq mm 2500 sq mm
2500 sq mm 2500 sq mm
≈ (V
(Backside)
P
D
Copper
MAX
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
8-PIN SOIC PACKAGE
Area
IN
MAX
= (T
– V
J
MAX
OUT
θ
JA
– T
Board
MIN
Area
A
)I
MAX
LOAD
)
IN
MAX
Resistance
Thermal
60°C/W
60°C/W
68°C/W
74°C/W
(θ
JA
JA
)
for
TABLE 4-2:
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
Find: 1. Actual power dissipation
Actual power dissipation:
P
Maximum allowable power dissipation:
In this example, the TC1263 dissipates a maximum of
260mW; below the allowable limit of 500mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
power dissipation of 500mW into Equation 4-1, from
which V
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm
D
IN
(Topside)*
Copper
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
= 260mW
, is found by substituting the maximum allowable
≈ (V
P
Area
V
V
I
T
T
θ
LOAD
D
A
JA
OUT
J
IN
2. Maximum allowable dissipation
MAX
MAX
MAX
IN
MAX
IN
MAX
MIN
MAX
MAX
= (T
= (125 – 95)
= 500mW
– V
= 4.6V.
= 3.3V ± 10%
= 2.7V ± 0.5%
= 275mA
= 125°C
= 95°C
= 60°C/W
J
2500 sq mm 2500 sq mm
(Backside)
MAX
60
OUT
Copper
GUIDELINES FOR TC1263 IN
3-PIN TO-220/DDPAK
PACKAGE
THERMAL RESISTANCE
Area
θ
– T
JA
MIN
A
)I
MAX
LOAD
)
MAX
Board
Area
TC1263
DS21374B-page 5
–3
Resistance
Thermal
25°C/W
27°C/W
35°C/W
(θ
JA
)