BA033CC0T Rohm Semiconductor, BA033CC0T Datasheet - Page 7

IC REG LDO 1A 3.3V TO220FP

BA033CC0T

Manufacturer Part Number
BA033CC0T
Description
IC REG LDO 1A 3.3V TO220FP
Manufacturer
Rohm Semiconductor
Datasheets

Specifications of BA033CC0T

Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
4 ~ 25 V
Voltage - Dropout (typical)
0.3V @ 500mA
Number Of Regulators
1
Current - Output
1A (Max)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack (Straight Leads)
Primary Input Voltage
25V
Output Voltage
3.3V
No. Of Pins
3
Output Current
1A
Voltage Regulator Case Style
TO-220
Operating Temperature Range
-40°C To +125°C
Svhc
No SVHC (18-Jun-2010)
Base N
RoHS Compliant
Number Of Outputs
1
Polarity
Positive
Output Type
Fixed
Dropout Voltage (max)
0.5 V
Line Regulation
100 mV
Load Regulation
150 mV
Voltage Regulation Accuracy
2 %
Maximum Power Dissipation
2 W
Maximum Operating Temperature
+ 105 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Output Voltage Fixed
3.3V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BA033CC0T
Quantity:
6 140
Part Number:
BA033CC0T
Manufacturer:
ROHM/罗姆
Quantity:
20 000
●Thermal Design
BA□□DD0T
BA□□DD0WT
© 2011 ROHM Co., Ltd. All rights reserved.
www.rohm.com
10
9
8
7
6
5
4
3
2
1
0
0
Board size : 70×70×1.6 ㎜
Board front copper foil area : 10.5×10.5 ㎜
①2-layer board (back surface copper foil area :15×15 ㎜
②2-layer board (back surface copper foil area :70×70 ㎜
③4-layer board (back surface copper foil area :70×70 ㎜
③7.3W
②5.5W
①2.3W
HRP-5
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The
IC characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature Tj
and long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from
thermal damage, it is necessary to operate it at temperatures lower than the maximum junction temperature Tj
Fig.30 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The method of calculating the power consumption Pc(W) is as follows.
Solving this for load current IO in order to operate within the acceptable loss:
It is then possible to find the maximum load current Io
・Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
25
Pc = (Vcc-Vo) × Io + Vcc × Icca
Acceptable loss Pd≦Pc
Io≦
Io≦
Io≦200mA (Icca : 2mA)
Pc=Vcc×(Icca+Ishort)
Ambient temperature:Ta( ℃)
Series
Pd – Vcc×Icca
1.04-8.3×Icca
50
Series
Vcc-Vo
Fig.29
,BA□□CC0T
3
75
,BA□□DD0HFP
(board contains a thermal via)
5
100
MAX
2
., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction
125
Series
(Please refer to Figs.8 and 20 for Icca.)
2
2
2
)
)
)
150
,BA□□CC0FP
Series
*Ishort : Short circuit current
,BA□□CC0WT
With the IC alone : θja=62.5℃/W → -16mW/℃
25℃=2000mW → 85℃=1040mW
25
20
15
10
5
0
0
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
(1)20.0
(2)2.0
TO220FP-5
25
Series
MAX
Ambient temperature:Ta(℃)
50
Series
with respect to the applied voltage Vcc at the time of thermal design.
7/11
Fig.30
75
,BA□□CC0WFP
100
125
150
Vcca:
Series
Vcc:
Vo:
Io:
Input voltage
Output voltage
Load current
Circuit current
2.0
1.6
1.2
0.8
0.4
0.0
0
TO252-5
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
1.30
25
Ambient temperature:Ta( ℃)
50
Technical Note
Fig.31
2011.03 - Rev.C
75
MAX
100
of the IC.
125
150

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