TC1262-3.0VDB Microchip Technology, TC1262-3.0VDB Datasheet - Page 4

• Manufacturer Part Number: TC1262-3.0VDB
• Description: IC CMOS LDO 500MA 3.0V SOT-223
• Manufacturer: Microchip Technology

Specifications of TC1262-3.0VDB

• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Regulator Topology: Positive Fixed
• Voltage - Output: 3V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.35V @ 500mA
• Number Of Regulators: 1
• Current - Output: 500mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Outputs: 1
• Input Voltage Max: 6 V
• Output Voltage: 3 V
• Output Voltage Tolerance: 2 %
• Output Type: Fixed
• Dropout Voltage (max): 650 mV
• Output Current: 500 mA
• Line Regulation: 0.003 V
• Load Regulation: 0.002 mA
• Voltage Regulation Accuracy: 0.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TC1262
4.0
4.1
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
(T
(θ
EQUATION 4-2:
Table 4-1 and Table 4-2 show various values of θ
the TC1262 packages.
TABLE 4-1:
*Tab of device attached to topside copper
DS21373B-page 4
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 1000 sq mm 1000 sq mm
1000 sq mm
225 sq mm
100 sq mm
(Topside)*
A
JA
J
MAX
MAX
Copper
I
).
Where:
LOAD
V
Area
V
OUT
) and the thermal resistance from junction-to-air
), the maximum allowable die temperature
IN
Where all terms are previously defined.
MAX
MAX
THERMAL CONSIDERATIONS
Thermal Shutdown
Power Dissipation
P
MIN
D
P
= Worst case actual power dissipation
= Maximum voltage on V
= Minimum regulator output voltage
= Maximum output (load) current
D
2500 sq mm 2500 sq mm
2500 sq mm 2500 sq mm
(Backside)
≈ (V
P
0 sq mm
Copper
D
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
SOT-223 PACKAGE
Area
MAX
IN
MAX
= (T
– V
J
MAX
OUT
θ
1000 sq mm
JA
– T
Board
Area
MIN
A
)I
MAX
LOAD
IN
)
MAX
Resistance
Thermal
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
(θ
JA
JA
)
for
TABLE 4-2:
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
Find: 1. Actual power dissipation
Actual power dissipation:
P
Maximum allowable power dissipation:
In this example, the TC1262 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
power dissipation of 508mW into Equation 4-1, from
which V
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
D
IN
125 sq mm
(Topside)*
Copper
, is found by sustituting the maximum allowable
≈ (V
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
= 260mW
P
Area
V
V
I
T
T
θ
D
LOAD
A
JA
J
IN
OUT
2. Maximum allowable dissipation
MAX
MAX
MAX
IN
MAX
IN
MAX
MAX
MIN
= (125 – 95)
= 508mW
= (T
MAX
– V
= 4.6V.
J
= 3.3V ± 10%
= 2.7V ± 0.5%
= 275mA
= 125°C
= 95°C
= 59°C/W (SOT-223)
2500 sq mm 2500 sq mm
MAX
(Backside)
59
OUT
Copper
θ
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
3-PIN DDPAK/TO-220
PACKAGE
Area
– T
JA
MIN
A
)I
MAX
©
LOAD
2002 Microchip Technology Inc.
)
MAX
Board
Area
–3
Resistance
Thermal
25°C/W
27°C/W
35°C/W
(θ
JA
)