MC78L24ACPG ON Semiconductor, MC78L24ACPG Datasheet - Page 2

• Manufacturer Part Number: MC78L24ACPG
• Description: IC REG POS 100MA 24V TO92
• Manufacturer: ON Semiconductor
• Type: Voltage Regulatorr

Specifications of MC78L24ACPG

• Regulator Topology: Positive Fixed
• Voltage - Output: 24V
• Voltage - Input: Up to 40V
• Voltage - Dropout (typical): 1.7V @ 40mA
• Number Of Regulators: 1
• Current - Output: 100mA
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-92-3 (Standard Body), TO-226
• Polarity: Positive
• Number Of Outputs: 1
• Output Type: Fixed
• Output Voltage: 24 V
• Output Current: 0.1 A
• Line Regulation: 350 mV
• Load Regulation: 200 mV
• Input Voltage Max: 40 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: 0 C
• Mounting Style: Through Hole
• Current, Input Bias: 3.1 mA
• Current, Output: 100 mA
• Package Type: TO-92
• Regulation, Line: 50 mV
• Regulation, Load: 40 mV
• Regulator Type: Positive Voltage Out
• Temperature, Operating, Range: 0 to +125 °C
• Voltage, Dropout: 1.7 VDC
• Voltage, Noise: 200 μV
• Voltage, Output: 24 V
• Voltage, Supply: 40 VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC78L24ACPGOS; MC78L24ACPGOSCT; MC78L24ACPGOSCT

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and is tested by the following methods:
2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8.
Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.
THERMAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Package Dissipation
Thermal Characteristics, TO−92
Thermal Resistance, Junction−to−Ambient
Thermal Characteristics, SOIC8
Thermal Resistance, Junction−to−Ambient
Input Voltage (5.0 V−9.0 V)
Input Voltage
Input Voltage
Storage Temperature Range
Maximum Junction Temperature
Moisture Sensitivity Level
ESD Capability, Human Body Model (Note 1)
ESD Capability, Machine Model (Note 1)
ESD Capability, Charged Device Model (Note 1)
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
(12 V−18 V)
(24 V)
Rating
Rating
http://onsemi.com
2
ESD
ESD
Symbol
Symbol
ESD
R
R
MSL
T
PD
V
T
stg
qJA
qJA
J
HBM
CDM
I
MM
Internally Limited
Refer to Figure 8
−65 to +150
Value
Value
2000
2000
150
200
200
30
35
40
1
°C/W
°C/W
Unit
Unit
Vdc
°C
°C
W
V
V
V
−