LP3966ES-2.5/NOPB National Semiconductor, LP3966ES-2.5/NOPB Datasheet - Page 15

• Manufacturer Part Number: LP3966ES-2.5/NOPB
• Description: IC REGULATOR ULTR LDO TO-263-5
• Manufacturer: National Semiconductor

Specifications of LP3966ES-2.5/NOPB

• Regulator Topology: Positive Fixed
• Voltage - Output: 2.5V
• Voltage - Input: Up to 7V
• Voltage - Dropout (typical): 0.8V @ 3A
• Number Of Regulators: 1
• Current - Output: 3A (Max)
• Current - Limit (min): 4A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-5, D²Pak (5 leads + Tab), TO-263BA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: *LP3966ES-2.5; *LP3966ES-2.5/NOPB; LP3966ES-2.5

Application Hints
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking. Figure 3 shows a curve for the
θ
a typical PCB with 1 ounce copper and no solder mask over
the copper area for heat sinking.
JA
FIGURE 3. θ
of TO-263 package for different copper area sizes, using
JA
vs Copper (1 Ounce) Area for TO-263
package
(Continued)
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15
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θ
32˚C/W.
Figure 4 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming θ
ture is 125˚C.
FIGURE 4. Maximum power dissipation vs ambient
JA
JA
temperature for TO-263 package
for the TO-263 package mounted to a PCB is
is 35˚C/W and the maximum junction tempera-
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