MIC39100-2.5WS TR Micrel Inc, MIC39100-2.5WS TR Datasheet - Page 10
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MIC39100-2.5WS TR
Manufacturer Part Number
MIC39100-2.5WS TR
Description
IC REG LDO 1A 2.5V SOT223
Manufacturer
Micrel Inc
Datasheet
1.MIC39100-2.5WS_TR.pdf
(12 pages)
Specifications of MIC39100-2.5WS TR
Regulator Topology
Positive Fixed
Voltage - Output
2.5V
Voltage - Input
Up to 16V
Voltage - Dropout (typical)
0.41V @ 1A
Number Of Regulators
1
Current - Output
1A (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Other names
576-1171-2
MIC39100/39101/39102
Adjustable Regulator Design
The MIC39102 allows programming the output voltage any-
where between 1.24V and the 16V maximum operating rating
of the family. Two resistors are used. Resistors can be quite
large, up to 1MΩ, because of the very high input impedance
and low bias current of the sense comparator: The resistor
values are calculated by:
Where V
component definition. Applications with widely varying load
currents may scale the resistors to draw the minimum load
current required for proper operation (see above).
Power SOIC-8 Thermal Characteristics
One of the secrets of the MIC39101/2’s performance is its
power SO-8 package featuring half the thermal resistance of
a standard SO-8 package. Lower thermal resistance means
more output current or higher input voltage for a given pack-
age size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a single-
piece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements, θ
tion-to-case thermal resistance) and θ
thermal resistance). See Figure 3. θ
the die to the leads of the package. θ
from the leads to the ambient air and it includes θ
to-sink thermal resistance) and θ
resistance).
M9999-082505
Figure 2. Adjustable Regulator with Resistors
Figure 4. Copper Area vs. Power-SOIC
O
SHUTDOWN
is the desired output voltage. Figure 2 shows
ENABLE
900
800
700
600
500
400
300
200
100
V
0
0
IN
Power Dissipation
∆T
V
0.25 0.50 0.75 1.00 1.25 1.50
OUT
POWER DISSIPATION (W)
J A
R1
IN
EN
=
=
MIC39102
1.240V 1
=
GND
R2
OUT
ADJ
SA
1.240
V
+
R2
OUT
R1
(sink-to-ambient thermal
JC
R1
R2
is the resistance from
CA
CA
−
1
(case-to-ambient
is the resistance
C
OUT
V
OUT
CS
JC
(case-
(junc-
10
Using the power SOIC-8 reduces the θ
allows the user to reduce θ
θ
factor in calculating the maximum power dissipation capabil-
ity of the device. Typically, the power SOIC-8 has a θ
20°C/W, this is significantly lower than the standard SOIC-8
which is typically 75°C/W. θ
through 8 can now be soldered directly to a ground plane
which significantly reduces the case-to-sink thermal resistance
and sink to ambient thermal resistance.
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important not to
exceed this maximum junction temperature during operation
of the device. To prevent this maximum junction temperature
from being exceeded, the appropriate ground plane heat sink
must be used.
Figure 4 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
above ambient.
From these curves, the minimum area of copper necessary for
the part to operate safely can be determined. The maximum
allowable temperature rise must be calculated to determine
operation along which curve.
JA
(junction-to-ambient thermal resistance) is the limiting
Figure 5. Copper Area vs. Power-SOIC
Figure 3. Thermal Resistance
900
800
700
600
500
400
300
200
100
0
printed circuit board
0
SOIC-8
Power Dissipation
T
0.25 0.50 0.75 1.00 1.25 1.50
J
POWER DISSIPATION (W)
T
= 125°C
A
= 85°C
JC
CA
JA
CA
. The total thermal resistance,
CA
is reduced because pins 5
50°C
AMBIENT
25°C
JC
ground plane
heat sink area
dramatically and
August 2005
Micrel
JC
of