MC33164D-3R2G ON Semiconductor, MC33164D-3R2G Datasheet - Page 10

• Manufacturer Part Number: MC33164D-3R2G
• Description: IC SENSING CIRCUIT UV 3V 8-SOIC
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MC33164D-3R2G

• Number Of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Voltage - Threshold: 2.68V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Monitored Voltage: 3 V
• Undervoltage Threshold: 2.71 V
• Output Type: Open Collector / Drain
• Manual Reset: Not Resettable
• Watchdog: No Watchdog
• Battery Backup Switching: No Backup
• Power-up Reset Delay (typ): Adjustable
• Supply Voltage (max): 10 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 24 uA
• Maximum Power Dissipation: 700 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Power Fail Detection: No
• Number Of Voltage Supervisors: 1
• Monitored Supervisor Voltage: 3
• Reset Threshold Voltage (min): 2.55V
• Reset Threshold Voltage (max): 2.8V
• Operating Supply Voltage (min): 1V
• Operating Supply Voltage (max): 10V
• Power Dissipation: 700mW
• Package Type: SOIC N
• Operating Temperature Classification: Automotive
• Operating Temp Range: -40C to 125C
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reset Timeout: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
PACKAGE DIMENSIONS
1.0
C A B
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
TSOP−5
K
10
0.074
DETAIL Z
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_