CG33.0L Littelfuse Inc, CG33.0L Datasheet - Page 3

• Manufacturer Part Number: CG33.0L
• Description: SURGE ARRESTER GDT 3000V AXIAL
• Manufacturer: Littelfuse Inc
• Series: CG3r
• Type: ESDr

Specifications of CG33.0L

• Package / Case: Axial
• Mounting Type: Through Hole
• Spark Over Voltage: 3000V
• Impulse Discharge Current: 10kA 8x20µs
• Peak Pulse Current: 10 A
• Dc Breakover Voltage (nominal): 3 KV
• Number Of Electrodes: 2
• Termination Style: Axial
• Failsafe Protection Y/n: N
• Dimensions: 8.1 mm D x 6.07 mm L
• Mounting Style: Through Hole
• Technology: Gas Plasma Arrester
• Brand/series: CG3 Series
• Capacitance: 1 pF
• Current, Supply: 300 A
• Package: Leads
• Voltage, Breakdown: 4800 V
• Voltage, Operating: 10 V
• Voltage, Reverse: 4800 V
• Dc Breakover Voltage: 3kV
• Impulse Sparkover Voltage: 6000V
• Gdt Case Style: Axial Leaded
• Breakdown Voltage Min: 2400V
• Breakdown Voltage Vbr: 3000V
• Rohs Compliant: No
• Impulse Discharge Current, 10/8-20us: 5kA
• Breakdown Voltage: 3600V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
300
280
260
240
220
200
180
160
140
120
100
S(max)
Time (Seconds)
80
60
40
20
L
0
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
p
)
Preheat Time
P
)
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
5°C/second max
217°C
60 – 150 seconds
260
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
Gas Discharge Tube (GDT) Products
AC and CG3 Series
Cooling Time
+0/-5
°C
Revised: January 21, 2011
15
Recommended Process Parameters:
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
time to peak temperature
(t 25ºC to peak)
t
Preheat
S
(Typical Industry Recommendation)
100
150
60-180 seconds
280
2-5 seconds
Ramp-up
Lead-Free Recommendation
°
°
°
C
C
C Maximum
t
t
P
L
Time
AC and CG3 Series
Ramp-down
Critical Zone
T
L
to T
P