MAX809RTRG ON Semiconductor, MAX809RTRG Datasheet - Page 12

• Manufacturer Part Number: MAX809RTRG
• Description: IC MPU SUPERVISORY 2.63V SOT23
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MAX809RTRG

• Number Of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 2.63V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Monitored Voltage: 1.2 V to 4.9 V
• Undervoltage Threshold: 2.63 V
• Overvoltage Threshold: 2.66 V
• Manual Reset: No
• Watchdog: No
• Battery Backup Switching: No
• Power-up Reset Delay (typ): 460 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 0.8 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 105 C
• Chip Enable Signals: No
• Internal Hysteresis: No
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 105 C
• Output Type: Push-Pull
• Power Fail Detection: No
• Current, Output: 20 mA
• Current, Supply: 2.5 μA
• Package Type: SOT-23
• Temperature, Operating, Range: -40 to +105 °C
• Voltage, Output, High: 4.4 V
• Voltage, Output, Low: 0.3 V
• Voltage, Supply: 1.2 to 5.5 V
• Number Of Elements: 1
• Monitored Voltage 1 (typ): 1.2 to 4.9V
• Threshold Voltage 1 (max): 2.66V
• Watchdog Timer: No
• Reset Active Time: 460ms
• Operating Supply Voltage (min): 1.2V
• Operating Supply Voltage (max): 5.5V
• Reset Threshold Voltage (max): 2.66V
• Reset Threshold Voltage (min): 2.59V
• Family Name: MAX809
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 3
• Supply Current: 0.0025mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX809RTRGOSTR

A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
VIEW C
L1
http://onsemi.com
SOT−23 (TO236)
L
CASE 318−08
ISSUE AN
q
0.25
12
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
inches
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
2.0
DIM
mm
A1
H
L1
A
b
c
D
E
e
L
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.047
0.070
0.004
0.014
0.083
0.110
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX