CG2350L Littelfuse Inc, CG2350L Datasheet - Page 4
CG2350L
Manufacturer Part Number
CG2350L
Description
SURGE ARRESTER GDT 350V AXIAL
Manufacturer
Littelfuse Inc
Series
CG2r
Specifications of CG2350L
Spark Over Voltage
350V
Impulse Discharge Current
20kA 8x20µs
Package / Case
Axial
Mounting Type
Through Hole
Peak Pulse Current
20 A
Dc Breakover Voltage (nominal)
350 V
Number Of Electrodes
2
Termination Style
Axial
Failsafe Protection Y/n
N
Dimensions
8.1 mm D x 6.07 mm L
Mounting Style
Through Hole
Technology
Gas Plasma Arrester
Voltage Rating
350 V
Dc Sparkover Voltage (typ)@100v/s
350
Impulse Sparkover Voltage (max)@100v/s
750
Failsafe Protection
No
Number Of Terminals
2
Product Length (mm)
6.07mm
Product Depth (mm)
8.1mm
Product Height (mm)
8.1mm
Capacitance (max)@1mhz
1
Operating Temperature Min Deg. C
-40C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
420-1079
420-1079
CG2-350L
420-1079
CG2-350L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CG2350L
Manufacturer:
CPC
Quantity:
20 000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within °C of actual peak
Temperature (t
Ramp-down Rate
Time 2 °C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
300
280
260
240
220
200
180
160
140
120
100
S(max)
Time (Seconds)
80
60
40
20
L
0
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
p
)
Preheat Time
P
)
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
150°C
200°C
5°C/second max
217°C
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Cooling Time
°C
Revised: January 21, 2011
33
Recommended Process Parameters:
Preheat:
Solder Pot Temperature:
Solder Dwell Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
time to peak temperature
(t 25ºC to peak)
t
Preheat
S
100
150
2-5 seconds
Ramp-up
Lead-Free Recommendation
°
°
°
C
C
t
t
P
L
Time
Ramp-down
Critical Zone
CG/CG2 Series
T
L
to T
P