MC33164P-5G ON Semiconductor, MC33164P-5G Datasheet - Page 10

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MC33164P-5G

Manufacturer Part Number
MC33164P-5G
Description
IC SENSOR UNDERVOLTAGE TO92
Manufacturer
ON Semiconductor
Type
Simple Reset/Power-On Resetr
Datasheet

Specifications of MC33164P-5G

Number Of Voltages Monitored
1
Output
Open Drain or Open Collector
Reset
Active Low
Voltage - Threshold
4.3V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-92-3 (Standard Body), TO-226
Monitored Voltage
5 V
Undervoltage Threshold
4.33 V
Overvoltage Threshold
4.45 V
Manual Reset
No
Watchdog
No
Battery Backup Switching
No
Power-up Reset Delay (typ)
Adj
Supply Voltage (max)
10 V
Supply Voltage (min)
1 V
Supply Current (typ)
32 uA
Maximum Power Dissipation
700 mW
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Chip Enable Signals
No
Internal Hysteresis
Yes
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 125 C
Output Type
Open Collector / Drain
Power Fail Detection
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reset Timeout
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33164P-5GOS
MC33164P-5GOSCT
MC33164P-5GOSCT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33164P-5G
Manufacturer:
ON Semiconductor
Quantity:
9 850
Part Number:
MC33164P-5G
Manufacturer:
ON/安森美
Quantity:
20 000
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
PACKAGE DIMENSIONS
1.0
C A B
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
TSOP−5
K
10
0.074
DETAIL Z
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_

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