NE5532D ON Semiconductor, NE5532D Datasheet
NE5532D
Specifications of NE5532D
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NE5532D Summary of contents
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NE5532, SA5532, SE5532, NE5532A, SE5532A Internally Compensated Dual Low Noise Operational Amplifier The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, such as the 1458, it shows better noise performance, improved ...
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Figure 1. Equivalent Schematic (Each Amplifier) MAXIMUM RATINGS Rating Supply Voltage Input Voltage Differential Input Voltage (Note 1) Operating Temperature Range NE5532/A SA5532 SE5532/A Storage Temperature Junction Temperature Maximum Power Dissipation 25°C (Still-Air) amb 8 D8 ...
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DC ELECTRICAL CHARACTERISTICS Characteristic Symbol Offset Voltage V OS − Offset Current I OS − Input Current I B − / Supply Current I CC − Common-Mode Input Range V CM Common-Mode Rejection Ratio ...
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AC ELECTRICAL CHARACTERISTICS ( Characteristic Output Resistance Overshoot Gain Gain Bandwidth Product Slew Rate Power Bandwidth ELECTRICAL CHARACTERISTICS ( Characteristic Symbol Input Noise Voltage V NOISE Input Noise Current I NOISE Channel Separation − 25° "15 ...
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TYPICAL PERFORMANCE CHARACTERISTICS 120 TYPICAL VALUES - (Hz) Figure 2. Open-Loop Frequency Response " ...
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... ALYWA SOIC−8 D SUFFIX CASE 751 800 W Figure 10. Test Circuits MARKING DIAGRAMS NE5532AN NE5532N AWL AWL YYWWG YYWWG 16 NE5532D AWLYYWWG 1 SOIC− SUFFIX CASE 751G A = Assembly Location WL Wafer Lot YY Year WW Work Week Pb−Free Packagee http://onsemi.com 6 V+ 5532 V OUT − + 100 pF 600 W V− ...
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... Plastic Small Outline (SO−16 WB) Package NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package NE5532D8 8−Pin Plastic Small Outline (SO−8) Packagee NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Packagee NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package NE5532N 8− ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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Plastic Dual In−Line Package (PDIP− −B− −A− NOTE 2 C −T− N SEATING PLANE 0.13 (0.005) M PACKAGE DIMENSIONS N SUFFIX CASE 626−05 ISSUE ...
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... B SEATING PLANE American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14 ...