EL5423CR-T7 Intersil, EL5423CR-T7 Datasheet - Page 16

• Manufacturer Part Number: EL5423CR-T7
• Description: IC OPAMP R-R 12CH 12MHZ 28-TSSOP
• Manufacturer: Intersil

Specifications of EL5423CR-T7

• Amplifier Type: Buffer
• Number Of Circuits: 12
• Output Type: Rail-to-Rail
• Slew Rate: 18 V/µs
• -3db Bandwidth: 12MHz
• Current - Input Bias: 2nA
• Voltage - Input Offset: 500µV
• Current - Supply: 7.8mA
• Current - Output / Channel: 200mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Gain Bandwidth Product: -

Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
0.10(0.004)
JEDEC MO-153-AC, Issue E.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
C A
SEATING PLANE
M
E1
-C-
-B-
B S
A
16
E
A1
α
0.10(0.004)
0.25(0.010)
EL5123, EL5223, EL5323, EL5423
GAUGE
PLANE
0.010
A2
M
0.25
B
M
L
c
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A2
E1
A
D
E
N
α
b
c
e
L
0.002
0.031
0.0075
0.0035
0.252
0.169
0.246
0.0177
MIN
0
-
0.026 BSC
o
INCHES
20
0.047
0.006
0.051
0.0118
0.0079
0.260
0.177
0.256
0.0295
MAX
8
o
MILLIMETERS
0.05
0.80
0.19
0.09
6.40
4.30
6.25
0.45
MIN
0
-
o
0.65 BSC
20
MAX
1.20
0.15
1.05
0.30
0.20
6.60
4.50
6.50
0.75
8
o
August 31, 2010
Rev. 1 6/98
NOTES
FN7176.3
9
3
4
6
7
-
-
-
-
-
-
-