EL5123CY-T7 Intersil, EL5123CY-T7 Datasheet - Page 17
![IC BUFFER QUAD R-R 12MHZ 10-MSOP](/photos/6/58/65824/20-10-msop_sml.jpg)
EL5123CY-T7
Manufacturer Part Number
EL5123CY-T7
Description
IC BUFFER QUAD R-R 12MHZ 10-MSOP
Manufacturer
Intersil
Datasheet
1.EL5423CLZ.pdf
(17 pages)
Specifications of EL5123CY-T7
Amplifier Type
Buffer
Number Of Circuits
4
Output Type
Rail-to-Rail
Slew Rate
18 V/µs
-3db Bandwidth
12MHz
Current - Input Bias
2nA
Voltage - Input Offset
500µV
Current - Supply
2.4mA
Current - Output / Channel
200mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Gain Bandwidth Product
-
Thin Shrink Small Outline Package Family (TSSOP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
N
1
C A B
A1
SEE DETAIL “X”
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
TOP VIEW
b
For information regarding Intersil Corporation and its products, see www.intersil.com
DETAIL X
SIDE VIEW
D
END VIEW
17
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
EL5123, EL5223, EL5323, EL5423
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
14 LD 16 LD 20 LD 24 LD 28 LD
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
MILLIMETERS
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
TOLERANCE
+0.05/-0.06
+0.05/-0.06
Reference
August 31, 2010
Rev. F 2/07
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
FN7176.3