AD8022ARM-REEL Analog Devices Inc, AD8022ARM-REEL Datasheet - Page 5

• Manufacturer Part Number: AD8022ARM-REEL
• Description: IC OPAMP VF DUAL LN LP 8MSOP
• Manufacturer: Analog Devices Inc

Specifications of AD8022ARM-REEL

• Rohs Status: RoHS non-compliant
• Design Resources: AD7266 SAR ADC in DC-Coupled Differential and Single-Ended Appls (CN0039) AD7265 in Differential and Single-Ended Configurations Using AD8022 (CN0048)
• Amplifier Type: Voltage Feedback
• Number Of Circuits: 2
• Slew Rate: 50 V/µs
• -3db Bandwidth: 130MHz
• Current - Input Bias: 2.5µA
• Voltage - Input Offset: 1500µV
• Current - Supply: 4mA
• Current - Output / Channel: 55mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 26 V, ±2.25 V ~ 13 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Power Supply Requirement: Single/Dual
• Package Type: MSOP
• Pin Count: 8
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage (+V
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature Range
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Specification is for the device in free air:
8-Lead SOIC: θ
8-Lead MSOP: θ
8-Lead SOIC (R)
8-Lead MSOP (RM)
(A Grade)
(Soldering 10 sec)
JA
JA
= 160°C/W.
= 200°C/W.
S
to −V
S
)
1
Rating
26.4 V
1.6 W
1.2 W
±V
±0.8 V
Observe Power Derating Curves
−65°C to +125°C
−40°C to +85°C
300°C
S
Rev. B | Page 5 of 16
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8022 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in
parametric performance due to a change in the stresses exerted
on the die by the package. Exceeding a junction temperature of
175°C for an extended period can result in device failure.
While the AD8022 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the
maximum power derating curves.
2.0
1.5
1.0
0.5
0
–50 –40 –30 –20 –10 0
Figure 3. Maximum Power Dissipation vs. Temperature
8-LEAD MSOP
8-LEAD SOIC PACKAGE
AMBIENT TEMPERATURE (°C)
10 20 30 40 50 60 70 80 90
T
J
AD8022
= 150°C