OP07CS Analog Devices Inc, OP07CS Datasheet - Page 6

• Manufacturer Part Number: OP07CS
• Description: IC OPAMP GP LDRIFT LN 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of OP07CS

• Slew Rate: 0.3 V/µs
• Amplifier Type: General Purpose
• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Number Of Circuits: 1
• Current - Input Bias: 1.8nA
• Voltage - Input Offset: 60µV
• Voltage - Supply, Single/dual (±): ±3 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• No. Of Amplifiers: 1
• Bandwidth: 600kHz
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Current - Supply: -
• Output Type: -
• Current - Output / Channel: -
• -3db Bandwidth: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OP07
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage (V
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Lead Temperature, Soldering (60 sec)
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
For supply voltages less than ±22 V, the absolute maximum input voltage is
equal to the supply voltage.
S and P Packages
OP07E
OP07C
1
S
)
Ratings
±22 V
±22 V
±30 V
Indefinite
−65°C to +125°C
0°C to 70°C
−40°C to +85°C
150°C
300°C
Rev. F | Page 6 of 16
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead PDIP (P-Suffix)
8-Lead SOIC_N (S-Suffix)
JA
is specified for the worst-case conditions, that is, a device
θ
103
158
JA
θ
43
43
JC
Unit
°C/W
°C/W