AD842JR-16 Analog Devices Inc, AD842JR-16 Datasheet - Page 3

• Manufacturer Part Number: AD842JR-16
• Description: IC OPAMP GP 80MHZ 100MA 16SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD842JR-16

• Rohs Status: RoHS non-compliant
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 375 V/µs
• Gain Bandwidth Product: 80MHz
• Current - Input Bias: 4.2µA
• Voltage - Input Offset: 500µV
• Current - Supply: 14mA
• Current - Output / Channel: 100mA
• Voltage - Supply, Single/dual (±): ±5 V ~ 18 V
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Output Type: -
• -3db Bandwidth: -

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ± 6 V
Storage Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
REV. E
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 W
TO-8 (H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
Q, H, E . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +125°C
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1
METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Contact factory for latest dimensions.
S
–3–
NOTES
1
2
Recommended Heat Sink: Aavid Engineering© #602B
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Maximum internal power dissipation is specified so that T
Plastic Package
Cerdip Package
TO-8 Package
16-Lead SOIC Package 30°C/W
20-Lead LCC Package 35°C/W
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
+150°C at an ambient temperature of +25°C.
Thermal Characteristics:
θ
30°C/W
30°C/W
30°C/W
JC
θ
100°C/W
110°C/W
100°C/W
100°C/W
150°C/W
JA
θ
38°C/W
27°C/W
SA
AD842
J
does not exceed