AD8608ARZ Analog Devices Inc, AD8608ARZ Datasheet - Page 21

• Manufacturer Part Number: AD8608ARZ
• Description: IC OPAMP GP R-R CMOS QUAD 14SOIC
• Manufacturer: Analog Devices Inc
• Series: DigiTrim®r
• Type: General Purpose Amplifierr

Specifications of AD8608ARZ

• Slew Rate: 5 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 10MHz
• Current - Input Bias: 0.2pA
• Voltage - Input Offset: 80µV
• Current - Supply: 1mA
• Current - Output / Channel: 80mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Op Amp Type: Precision
• No. Of Amplifiers: 4
• Bandwidth: 10MHz
• Supply Voltage Range: 2.7V To 5.5V
• Amplifier Case Style: SOIC
• No. Of Pins: 14
• Rail/rail I/o Type: Rail to Rail Input/Output
• Number Of Elements: 4
• Unity Gain Bandwidth Product: 10MHz
• Common Mode Rejection Ratio: 85dB
• Input Offset Voltage: 300uV
• Input Bias Current: 1pA
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Voltage Gain In Db: 120dB
• Power Supply Rejection Ratio: 77dB
• Power Supply Requirement: Single
• Shut Down Feature: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Technology: CMOS
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant

IDENTIFIER
BALL 1
COPLANARITY
IDENTIFIER
0.25 (0.0098)
0.10 (0.0040)
(BALL SIDE DOWN)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COPLANARITY
TOP VIEW
3.20
3.00
2.80
0.95
0.85
0.75
4.00 (0.1574)
3.80 (0.1497)
0.15
0.05
PIN 1
1.480
1.430
1.380
0.10
Figure 60. 8-Lead Standard Small Outline Package [SOIC_N]
Figure 61. 8-Ball Wafer Level Chip Scale Package [WLCSP]
SEATING
Figure 59. 8-Lead Mini Small Outline Package [MSOP]
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Dimensions shown in millimeters and (inches)
8
1
0.65 BSC
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
3.20
3.00
2.80
1
8
Dimensions shown in millimeters
1.825
1.775
1.725
Dimensions shown in millimeters
BSC
5
4
0.40
0.25
5
4
0.380
0.355
0.330
0.51 (0.0201)
0.31 (0.0122)
Rev. J | Page 21 of 24
Narrow Body (R-8)
1.10 MAX
5.15
4.90
4.65
6.20 (0.2441)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
(CB-8-1)
(RM-8)
6°
0°
0.675
0.595
0.515
0.27
0.24
0.21
15° MAX
0.25 (0.0098)
0.17 (0.0067)
0.50
BALL PITCH
SEATING
PLANE
8°
0°
0.23
0.09
0.340
0.320
0.300
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
3
0.80
0.55
0.40
BOTTOM VIEW
(BALL SIDE UP)
2
45°
AD8605/AD8606/AD8608
1
B
A
C