OP97FSZ Analog Devices Inc, OP97FSZ Datasheet - Page 2

• Manufacturer Part Number: OP97FSZ
• Description: IC OPAMP GP LP PREC 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of OP97FSZ

• Slew Rate: 0.2 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• -3db Bandwidth: 900kHz
• Current - Input Bias: 30pA
• Voltage - Input Offset: 30µV
• Current - Supply: 380µA
• Voltage - Supply, Single/dual (±): ±2 V ~ 20 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Precision
• No. Of Amplifiers: 1
• Bandwidth: 900kHz
• Supply Voltage Range: ± 2V To ± 20V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Common Mode Rejection Ratio: 132
• Current, Input Bias: ±30 pA
• Current, Input Offset: 30 pA
• Current, Supply: 380 μA
• Impedance, Thermal: 43 °C/W
• Package Type: SOIC-8
• Resistance, Input: 30 Megohms
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Gain: 2000 V/mV
• Voltage, Input: ±20 V
• Voltage, Noise: 17 nV/sqrt Hz
• Voltage, Offset: 30 μV
• Voltage, Output, High: +14 V
• Voltage, Output, Low: -14 V
• Voltage, Supply: ±15 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Current - Output / Channel: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

OP97
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Connections ............................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
REVISION HISTORY
3/09—Rev. F to Rev. G
Changes to Figure 20 and Figure 23 ............................................... 9
Changes to Figure 26 and Figure 27 ............................................. 10
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
11/07—Rev. E to Rev. F
Updated Format .................................................................. Universal
Changes to Ordering Guide .......................................................... 16
07/03—Rev. D to Rev. E
Deleted H-08A .................................................................... Universal
Deleted Q-8 ......................................................................... Universal
Deleted E-20A ..................................................................... Universal
Deleted Die Characteristics ............................................................. 4
Deleted Wafer Test Limits ............................................................... 4
Updated TPC 14 ............................................................................... 5
Updated Outline Dimensions ....................................................... 10
Electrical Characteristics ............................................................. 3
Thermal Resistance ...................................................................... 5
Rev. G | Page 2 of 16
Typical Performance Characteristics ..............................................6
Application Information ................................................................ 11
AC Performance ............................................................................. 12
Guarding and Shielding ................................................................. 13
Outline Dimensions ....................................................................... 15
01/02—Rev. C to Rev. D
Edits to Absolute Maximum Ratings .............................................. 3
Edits to Ordering Guide ................................................................... 3
Deleted DICE Characteristics .......................................................... 3
Deleted Wafer Test Limits ................................................................ 3
Edits to Applications Information ................................................... 7
ESD Caution...................................................................................5
Ordering Guide .......................................................................... 16