AD8061AR Analog Devices Inc, AD8061AR Datasheet - Page 6

• Manufacturer Part Number: AD8061AR
• Description: IC OPAMP VF R-R LP 50MA 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8061AR

• Rohs Status: RoHS non-compliant
• Amplifier Type: Voltage Feedback
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 650 V/µs
• -3db Bandwidth: 320MHz
• Current - Input Bias: 3.5µA
• Voltage - Input Offset: 1000µV
• Current - Supply: 6.8mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 8 V, ±1.35 V ~ 4 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Gain Bandwidth Product: -

AD8061/AD8062/AD8063
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common-Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering,
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Specification is for device in free air.
8-lead SOIC (R)
5-lead SOT-23 (RJ)
6-lead SOT-23 (RJ)
8-lead MSOP (RM)
R-8, RM-8, SOT-23-5, SOT-23-6
10 sec)
8-Lead SOIC_N: θ
5-Lead SOT-23: θ
6-Lead SOT-23: θ
8-Lead MSOP: θ
JA
JA
JA
JA
= 200°C/W; θ
= 240°C/W; θ
= 230°C/W; θ
= 160°C/W; θ
1
JC
JC
JC
JC
= 44°C/W.
= 92°C/W.
= 92°C/W.
= 56°C/W.
Rating
8 V
0.8 W
0.5 W
0.5 W
0.6 W
(−V
±V
Observe power derating curves
−65°C to +125°C
−40°C to +85°C
300°C
S
S
− 0.2 V) to (+V
S
+ 0.2 V)
Rev. G | Page 6 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8061/AD8062/AD8063 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure. While the
AD8061/AD8062/AD8063 is internally short-circuit protected,
this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all
conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
Figure 6. Maximum Power Dissipation vs. Temperature for
2.0
1.5
1.0
0.5
0
–50 –40 –30
8-LEAD SOIC
PACKAGE
MSOP
–20
AD8061/AD8062/AD8063
–10
AMBIENT TEMPERATURE (°C)
SOT-23-5, SOT-23-6
0
10
20
30
40
T
50
J
= 150°C
60
70 80
90