LM324DT Rohm Semiconductor, LM324DT Datasheet - Page 7

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LM324DT

Manufacturer Part Number
LM324DT
Description
IC OPAMP QUAD 32V 14SOIC
Manufacturer
Rohm Semiconductor
Series
Signaturer
Datasheet

Specifications of LM324DT

Amplifier Type
General Purpose
Number Of Circuits
4
Slew Rate
0.4 V/µs
Gain Bandwidth Product
1.3MHz
Current - Input Bias
20nA
Voltage - Input Offset
7000µV
Current - Supply
1.5mA
Current - Output / Channel
20mA
Voltage - Supply, Single/dual (±)
3 V ~ 32 V, ±1.5 V ~ 16 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
14-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-

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●Derating curves
●Precautions
© 2010 ROHM Co., Ltd. All rights reserved.
LM358DT/PT/ST/WDT/WPT,LM2904DT/PT/ST/WDT/WPT
LM324DT/PT/WDT,LM2902DT/PT/WDT
www.rohm.com
1) Unused circuits
2) Input terminal voltage
3) Power supply (single / dual)
4) Power dissipation (Pd)
5) Short-circuit between pins and erroneous mounting
6) Operation in a strong electromagnetic field
7) Radiation
8) IC handing
9) IC operation
10) Board inspection
11) Output capacitor
When there are unused circuits, it is recommended that they be connected as in Fig.7, setting the
non-inverting input terminal to a potential within the in-phase input voltage range (VICM).
Applying Vcc
characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
The op-amp operates when the voltage supplied is between Vcc
Therefore, the single supply op-mp can be used as a dual supply op-amp as well.
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise in chip temperature, including
reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient
margin in thermal design. Refer to the thermal derating curves for more information.
Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output and the power supply, or the output
and Vcc
Operation in a strong electromagnetic field may cause malfunctions.
This IC is not designed to withstand radiation.
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical characteristics due to piezoelectric (piezo)
effects.
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to the middle potential of Vcc
Vcc
terminal and Vcc
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition,
when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please
take measures against ESD in the assembly process as well as during transportation and storage.
Discharge of the external output capacitor to Vcc
circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage
comparators, use an output capacitor with a capacitance less than 0.1μF.
-
, crossover distortion occurs at the changeover between discharging and charging of the output current. Connecting a resistor between the output
-
may result in IC destruction.
-
+ 32V to the input terminal is possible without causing deterioration of the electrical
-
, and increasing the bias current for Class A operation will suppress crossover distortion.
1000
800
600
400
200
θja = (Tj-Ta)/Pd[℃/W]
0
SO Package8 (*7)
TSSOP8 (*5)
Mini SO8 (*6)
LM358DT/PT/ST/WDT/WPT
25
Ambient temperature : Ta [ ℃ ]
50
Package
500[mV] TSSOP8 (*5)
470[mV] Mini SO8 (*6)
450[mV] SO package8 (*7)
75
+
70[ ℃ ]
is possible via internal parasitic elements when Vcc
Power Dissipation
100
125
+
Fig.6 Derating Curves
and Vcc
150
-
.
7/9
Pd[W]
450
500
470
1000
800
600
400
200
0
LM2904DT/PT/ST/WDT/WPT
θja [℃/W]
25
Ambient temperature : Ta [ ℃ ]
3.76
3.6
4.0
+
is shorted to Vcc
50
500[mV] TSSOP8 (*5)
470[mV] Mini SO8 (*6)
450[mV] SO package8 (*7)
75
Fig.7 Disable circuit example
100
connect
to Vicm
-
, causing damage to the internal
125[ ℃ ]
125
Technical Note
2010.04 - Rev.A
150
Vcc
Vcc
+
-
+
and

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