LT6012ACGN#PBF Linear Technology, LT6012ACGN#PBF Datasheet - Page 12

• Manufacturer Part Number: LT6012ACGN#PBF
• Description: IC OP AMP PREC QUAD R-R 16-SSOP
• Manufacturer: Linear Technology
• Type: General Purpose Amplifierr

Specifications of LT6012ACGN#PBF

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.11 V/µs
• Gain Bandwidth Product: 350kHz
• Current - Input Bias: 20pA
• Voltage - Input Offset: 35µV
• Current - Supply: 260µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 36 V, ±1.35 V ~ 18 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Rail/rail I/o Type: Rail to Rail Output
• Number Of Elements: 4
• Unity Gain Bandwidth Product: 0.33MHz
• Common Mode Rejection Ratio: 107dB
• Input Offset Voltage: 85uV
• Input Bias Current: 300pA
• Single Supply Voltage (typ): 3/5/9/12/15/18/24/28V
• Voltage Gain In Db: 126.02dB
• Power Supply Rejection Ratio: 112dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±1.35V
• Dual Supply Voltage (max): ±18V
• Technology: Bipolar
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SSOP N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTIO
LT6011/LT6012
12
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
.030 ± .005
(0.203 – 0.254)
.008 – .010
TYP
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.245
MIN
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
2.38 ±0.05
(2 SIDES)
(0.254 – 0.508)
0.50
BSC
.010 – .020
.050 BSC
(0.406 – 1.270)
(MILLIMETERS)
.016 – .050
U
0.675 ±0.05
INCHES
8-Lead Plastic Small Outline (Narrow .150 Inch)
× 45°
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1610)
.045 ± .005
.160 ± .005
TOP MARK
0°– 8° TYP
(NOTE 6)
PIN 1
0.200 REF
DD Package
S8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
(5.791 – 6.197)
ON TOP AND BOTTOM OF PACKAGE
.228 – .244
(1.346 – 1.752)
(0.355 – 0.483)
.053 – .069
.014 – .019
TYP
8
1
(4.801 – 5.004)
.189 – .197
3.00 ±0.10
0.75 ±0.05
7
2
(4 SIDES)
NOTE 3
6
3
0.00 – 0.05
5
4
1.65 ± 0.10
(2 SIDES)
(1.270)
.050
BSC
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
SO8 0303
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 1203
60112fb