LT6600CS8-15#PBF Linear Technology, LT6600CS8-15#PBF Datasheet - Page 11

• Manufacturer Part Number: LT6600CS8-15#PBF
• Description: IC AMP DIFF LP FLTR 15MHZ 8-SOIC
• Manufacturer: Linear Technology

Specifications of LT6600CS8-15#PBF

• Amplifier Type: Differential
• Number Of Circuits: 1
• Output Type: Differential
• Current - Input Bias: 35µA
• Voltage - Input Offset: 10000µV
• Current - Supply: 38mA
• Voltage - Supply, Single/dual (±): 3 V ~ 11 V, ±1.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• No. Of Amplifiers: 1
• Input Offset Voltage: 35mV
• Bandwidth: 15MHz
• Supply Voltage Range: 3V To 11V
• Supply Current: 38mA
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -
• Slew Rate: -
• Gain Bandwidth Product: -

APPLICATIONS INFORMATION
Table 2. LT6600-15 SO-8 Package Thermal Resistance
Junction temperature, T
temperature, T
dissipation is the product of supply voltage, V
supply current, I
is given by:
where the supply current, I
level, load impedance, temperature and common mode
voltages.
PACKAGE DESCRIPTION
TOPSIDE
(mm
T
1100
330
J
35
35
COPPER AREA
0
= T
2
)
A
+ (P
BACKSIDE
(mm
1100
330
35
D
0
0
A
, and power dissipation, P
2
• θ
)
S
. Therefore, the junction temperature
JA
) = T
BOARD AREA
(mm
J
2500
2500
2500
2500
2500
, is calculated from the ambient
.030 ±.005
A
(0.203 – 0.254)
+ (V
2
.008 – .010
)
TYP
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.245
MIN
S
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
, is a function of signal
S
• I
(0.254 – 0.508)
(JUNCTION-TO-AMBIENT)
.010 – .020
.050 BSC
THERMAL RESISTANCE
S
• θ
8-Lead Plastic Small Outline (Narrow .150 Inch)
(0.406 – 1.270)
(MILLIMETERS)
.016 – .050
JA
100°C/W
105°C/W
INCHES
65°C/W
85°C/W
95°C/W
× 45°
)
D
. The power
(Reference LTC DWG # 05-08-1610)
.045 ±.005
.160 ±.005
S
, and
0°– 8° TYP
S8 Package
(5.791 – 6.197)
.228 – .244
For a given supply voltage, the worst-case power dissi-
pation occurs when the differential input signal is maxi-
mum, the common mode currents are maximum (see
the Applications Information section regarding common
mode DC currents), the load impedance is small and the
ambient temperature is maximum. To compute the junc-
tion temperature, measure the supply current under these
worst-case conditions, estimate the thermal resistance
from Table 2, then apply the equation for T
using the circuit in Figure 3 with a DC differential input
voltage of 250mV, a differential output voltage of 1V, no
load resistance and an ambient temperature of 85°C, the
supply current (current into Pin 3) measures 50mA. As-
suming a PC board layout with a 35mm
θ
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep T
below 150°C.
(1.346 – 1.752)
(0.355 – 0.483)
.053 – .069
JA
.014 – .019
T
TYP
J
is 100°C/W. The resulting junction temperature is:
= T
8
1
A
(4.801 – 5.004)
+ (P
.189 – .197
7
2
NOTE 3
D
6
3
• θ
JA
5
4
) = 85 + (5 • 0.05 • 100) = 110°C
(1.270)
.050
BSC
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
SO8 0303
LT6600-15
2
copper trace, the
J
. For example,
11
660015fb
J