LT6600CS8-5#PBF Linear Technology, LT6600CS8-5#PBF Datasheet - Page 11

• Manufacturer Part Number: LT6600CS8-5#PBF
• Description: IC AMP DIFF LP FLTR 5MHZ 8-SOIC
• Manufacturer: Linear Technology

Specifications of LT6600CS8-5#PBF

• Amplifier Type: Differential
• Number Of Circuits: 1
• Output Type: Differential
• Current - Input Bias: 30µA
• Voltage - Input Offset: 8000µV
• Current - Supply: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 11 V, ±1.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -
• Slew Rate: -
• Gain Bandwidth Product: -

APPLICATIONS INFORMATION
Junction temperature, T
temperature, T
dissipation is the product of supply voltage, V
supply current, I
is given by:
where the supply current, I
load impedance, temperature and common mode volt-
ages.
For a given supply voltage, the worst-case power dis-
sipation occurs when the differential input signal is
maximum, the common mode currents are maximum
(see Applications Information regarding common mode
DC currents), the load impedance is small and the ambi-
PACKAGE DESCRIPTION
T
J
= T
A
+ (P
D
A
, and power dissipation, P
• θ
S
. Therefore, the junction temperature
.030 ±.005
JA
(0.203 – 0.254)
) = T
.008 – .010
TYP
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.245
MIN
J
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
, is calculated from the ambient
A
S
+ (V
, is a function of signal level,
(0.254 – 0.508)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
.010 – .020
.050 BSC
S
• I
(0.406 – 1.270)
(MILLIMETERS)
S
.016 – .050
• θ
8-Lead Plastic Small Outline (Narrow .150 Inch)
INCHES
× 45°
JA
)
D
. The power
(Reference LTC DWG # 05-08-1610)
.045 ±.005
.160 ±.005
S
0°– 8° TYP
, and
S8 Package
(5.791 – 6.197)
.228 – .244
ent temperature is maximum. To compute the junction
temperature, measure the supply current under these
worst-case conditions, estimate the thermal resistance
from Table 2, then apply the equation for T
using the circuit in Figure 3 with DC differential input volt-
age of 250mV, a differential output voltage of 1V, 1kΩ load
resistance and an ambient temperature of 85°C, the supply
current (current into Pin 3) measures 32.2mA. Assuming
a PC board layout with a 35mm
100°C/W. The resulting junction temperature is:
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep T
below 150°C.
(1.346 – 1.752)
(0.355 – 0.483)
.053 – .069
.014 – .019
T
J
TYP
= T
A
1
8
+ (P
(4.801 – 5.004)
.189 – .197
2
7
D
NOTE 3
• θ
JA
6
3
) = 85 + (5 • 0.0322 • 100) = 101°C
5
4
(1.270)
.050
BSC
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
2
SO8 0303
copper trace, the θ
LT6600-5
J
. For example,
11
66005fb
JA
is
J