LT1638HS8 Linear Technology, LT1638HS8 Datasheet - Page 14

• Manufacturer Part Number: LT1638HS8
• Description: IC OPAMP R-R IN/OUT DUAL 8-SOIC
• Manufacturer: Linear Technology
• Series: Over-The-Top®r

Specifications of LT1638HS8

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.4 V/µs
• Gain Bandwidth Product: 1.2MHz
• Current - Input Bias: 20nA
• Voltage - Input Offset: 250µV
• Current - Supply: 205µA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 44 V, ±1.25 V ~ 22 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• -3db Bandwidth: -

LT1638/LT1639
PACKAGE DESCRIPTION
3.5 0.05
14
(.0165 .0015)
0.42 0.038
2.10 0.05
TYP
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
ON TOP AND BOTTOM OF PACKAGE
1.65 0.05
(2 SIDES)
0.25 0.05
2.38 0.05
0.889 0.127
(.0256)
(.035 .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
0.50
BSC
0.70 0.05
GAUGE PLANE
(.007)
PACKAGE
OUTLINE
0.18
(Reference LTC DWG # 05-08-1660 Rev F)
(Reference LTC DWG # 05-08-1698 Rev C)
8-Lead Plastic DFN (3mm × 3mm)
(.010)
0.254
TOP MARK
8-Lead Plastic MSOP
(NOTE 6)
PIN 1
MS8 Package
0.200 REF
DD Package
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.021 .006)
0.53 0.152
SEATING
PLANE
0.75 0.05
3.00 0.10
(4 SIDES)
(.193 .006)
4.90 0.152
(.118 .004)
3.00 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
0.00 – 0.05
TYP
(.043)
MAX
1.10
1.65 0.10
(2 SIDES)
(.0256)
0.65
BSC
1
8
BOTTOM VIEW—EXPOSED PAD
7 6 5
2 3
0.25 0.05
R = 0.125
TYP
4
4
5
2.38 0.10
(.118 .004)
3.00 0.102
(.0205)
(NOTE 4)
(.034)
0.52
0.86
REF
0.1016 0.0508
REF
MSOP (MS8) 0307 REV F
(.004 .002)
8
1
0.50 BSC
0.40 0.10
(DD8) DFN 0509 REV C
16389ff