LTC2051HMS8 Linear Technology, LTC2051HMS8 Datasheet - Page 9

• Manufacturer Part Number: LTC2051HMS8
• Description: IC OP-AMP ZERO-DRIFT DUAL 8-MSOP
• Manufacturer: Linear Technology

Specifications of LTC2051HMS8

• Amplifier Type: Chopper (Zero-Drift)
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 2 V/µs
• Gain Bandwidth Product: 3MHz
• Current - Input Bias: 90pA
• Voltage - Input Offset: 1µV
• Current - Supply: 850µA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 7 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Output / Channel: -
• -3db Bandwidth: -

TYPICAL APPLICATIO
PACKAGE DESCRIPTIO
LT1677
LT1012
A1
TOP MARK
(NOTE 6)
750Ω
2.49k
R1
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
3.01k
57Ω
R2
+
–
0.75 ±0.05
3.00 ±0.10
U
(4 SIDES)
2
3
340k
250k
R3
U
1/2 LTC2051
–
+
0.00 – 0.05
Obtaining Ultralow V
3
2
1.65 ± 0.10
–
R1
+
(2 SIDES)
8-Lead Plastic DFN (3mm × 3mm)
A1
1
(Reference LTC DWG # 05-08-1698)
5V
1
10k
10k
R4
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
8
R2
R = 0.115
R4
6
TYP
4
5
2.38 ±0.10
(2 SIDES)
OUT
DD Package
5
6
1/2 LTC2051
+
–
R5
R3
100k
100k
R5
OS
C2
8
1
0.50 BSC
Drift and Low Noise
0.38 ± 0.10
C1
7
0.01μF
0.01μF
C1
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.001μF
0.001μF
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
C2
LTC2051/LTC2052
20512 F01
OUT
2.38 ±0.05
(2 SIDES)
e
IN
0.15μV
0.3μV
(DC – 1Hz)
0.50
BSC
P-P
P-P
0.675 ±0.05
PACKAGE
OUTLINE
(DD) DFN 1203
e
IN
0.2μV
0.4μV
(DC – 10Hz)
P-P
P-P
20512fd
9