LT1637HS8#TRPBF Linear Technology, LT1637HS8#TRPBF Datasheet - Page 14
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LT1637HS8#TRPBF
Manufacturer Part Number
LT1637HS8#TRPBF
Description
IC OPAMP R-R IN/OUT 1.1MHZ 8SOIC
Manufacturer
Linear Technology
Series
Over-The-Top®r
Datasheet
1.LT1637CS8PBF.pdf
(16 pages)
Specifications of LT1637HS8#TRPBF
Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Slew Rate
0.4 V/µs
Gain Bandwidth Product
1.1MHz
Current - Input Bias
17nA
Voltage - Input Offset
100µV
Current - Supply
230µA
Current - Output / Channel
31.7mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 44 V, ±1.35 V ~ 22 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LT1637
PACKAGE DESCRIPTIO
14
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(.0165 ± .0015)
0.42 ± 0.038
GAUGE PLANE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
TYP
2.38 ±0.05
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
U
0.254
(.010)
0.675 ±0.05
PACKAGE
OUTLINE
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
DETAIL “A”
0° – 6° TYP
(.0256)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
8-Lead Plastic MSOP
TOP MARK
(NOTE 6)
0.53 ± 0.152
(.021 ± .006)
MS8 Package
PIN 1
DD Package
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
SEATING
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
PLANE
4.90 ± 0.152
(.193 ± .006)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
1
8
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(.034)
(NOTE 4)
0.52
0.86
REF
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD) DFN 1203
1637fd