MC33071ADG ON Semiconductor, MC33071ADG Datasheet - Page 22

• Manufacturer Part Number: MC33071ADG
• Description: IC OPAMP SINGLE 4.5MHZ 8SOIC
• Manufacturer: ON Semiconductor

Specifications of MC33071ADG

• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 13 V/µs
• Gain Bandwidth Product: 4.5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 500µV
• Current - Supply: 1.9mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 44 V, ±1.5 V ~ 22 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 80 dB
• Input Voltage Range (max): Positive Rail - 1.8 V
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 3 mV
• Input Bias Current (max): 500 nA
• Operating Supply Voltage: 44 V
• Supply Current: 1.9 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V, +/- 9 V
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Dual Supply Voltage: +/- 1.5 V
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 44 V
• Supply Voltage (min): 3 V
• Technology: Bipolar
• Voltage Gain Db: 100 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC33071ADGOS

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
1
PACKAGE DIMENSIONS
B
1.26
T
H
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
22
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_