PA241CEM Cirrus Logic Inc, PA241CEM Datasheet

PA241CEM

Manufacturer Part Number

PA241CEM

Description

OP AMP HV 350V .06A 8P TO-3 MIL

Manufacturer

Cirrus Logic Inc

Series

Apex Precision Power™r

Datasheets

1.PA241DF.pdf (3 pages)

2.PA241CEM.pdf (2 pages)

Specifications of PA241CEM

Amplifier Type

Power

Number Of Circuits

Slew Rate

30 V/µs

Gain Bandwidth Product

3MHz

Current - Input Bias

5pA

Voltage - Input Offset

25000µV

Current - Supply

2.2mA

Current - Output / Channel

120mA

Voltage - Supply, Single/dual (±)

100 V ~ 350 V, ±50 V ~ 175 V

Operating Temperature

-25°C ~ 85°C

Mounting Type

Through Hole

Package / Case

TO-3-8

For Use With

598-1459 - EVALUATION KIT FRO PA241DF

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Output Type

-3db Bandwidth

Other names

598-1432
PA241CEM

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

PA241CEM

Manufacturer:

APEX

Quantity:

20 000

Current page: 1 of 3
Download datasheet (463Kb)

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EVALUATION KIT

evaluation of the PA241CE. Provided items include: PC boards

to make a ﬁve sided box, cage jacks and 200V ceramic bypass

capacitors. The top board has pads for two TO-3 packages

and one MO127 package. Two ends of the box are predrilled

for banana jacks and BNC connectors (not supplied). Ampli-

ﬁers and heatsinks are sold separately.

evaluation of the PA241DW. Ampliﬁers are sold separately.

evaluation of the PA241DF surface mount package. Pro-

vided items include: PC board, ceramic bypass capacitor,

surface mount heatsink rated at 20°C/W. Ampliﬁers are sold

separately.

the PA241CE in the TO-3 package. Thermal ratings are for

optimum mounting in free air.

HS01 11.6°C/W

HS02 4.5°C/W

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

HEATSINKS FOR THE CE (TO-3) PACKAGE

EK09 is an easy to use engineering platform for prototype

EK42 is an easy to use PC board platform for prototype

EK13 is an easy to use engineering platform for prototype

The following heatsinks are mechanically compatible with

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HS03 1.7°C/W

HS04 0.95°C/W

HS05 0.85°C/W

Related parts for PA241CEM

PA241CEM Summary of contents

Page 1

EVALUATION KIT EK09 is an easy to use engineering platform for prototype evaluation of the PA241CE. Provided items include: PC boards to make a ﬁve ...

HS09 11.7°C/W HS11 0.68°C/W With liquid cooling the HS11 thermal rating can be reduced to .1°C/W. HS13 1.48°C/W APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 2 HS14 ...

Page 3

Part number MS02 consists of a package of 8 cage jacks. These are mounted directly in a print circuit board. Use a spacer between the PCB and the heatsink to avoid short circuits. SOCKET FOR THE CE (TO-3) PACKAGE MS03 ...

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PA241CEM Cirrus Logic Inc, PA241CEM Datasheet

PA241CEM

Specifications of PA241CEM

Available stocks

Related parts for PA241CEM

PA241CEM Summary of contents

Page 1

Page 2

Page 3

Related keywords