ADA4850-2YCPZ-R2 Analog Devices Inc, ADA4850-2YCPZ-R2 Datasheet - Page 5

• Manufacturer Part Number: ADA4850-2YCPZ-R2
• Description: IC OPAMP VF R-R DUAL 16LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADA4850-2YCPZ-R2

• Slew Rate: 220 V/µs
• Amplifier Type: Voltage Feedback
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• -3db Bandwidth: 175MHz
• Current - Input Bias: 2.3µA
• Voltage - Input Offset: 600µV
• Current - Supply: 2.5mA
• Current - Output / Channel: 118mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Op Amp Type: High Speed
• No. Of Amplifiers: 2
• Bandwidth: 175MHz
• Supply Voltage Range: 2.7V To 6V
• Amplifier Case Style: LFCSP
• No. Of Pins: 16
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: ADA4850-2YCPZ-R2TR

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Power Down Pin Voltage
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for the device soldered in the circuit board for surface-
mount packages.
Table 4. Thermal Resistance
Package Type
16-Lead LFCSP
8-Lead LFCSP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4850-1/
ADA4850-2 is limited by the associated rise in junction
temperature (T
the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
ADA4850-1/ADA4850-2. Exceeding a junction temperature of
150°C for an extended period of time can result in changes in
silicon devices, potentially causing degradation or loss of
functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
(Soldering 10 sec)
is specified for the worst-case conditions, that is, θ
J
) on the die. At approximately 150°C, which is
Rating
12.6 V
See Figure 4
(−V
(−V
+V
−65°C to +125°C
−40°C to +125°C
300°C
150°C
θ
91
80
JA
S
S
S
to −V
+ 6) V
− 0.5 ) V to (+V
S
Unit
°C/W
°C/W
JA
S
is
+ 0.5) V
Rev. A | Page 5 of 16
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the die
due to the ADA4850-1/ADA4850-2 drive at the output. The
quiescent power is the voltage between the supply pins (V
times the quiescent current (I
RMS output voltages should be considered. If R
to −V
V
the worst case, when V
In single-supply operation with R
case is V
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads and
exposed paddle from metal traces, through holes, ground, and
power planes reduce θ
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP (91°C/W)
package on a JEDEC standard 4-layer board. θ
approximations.
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
× I
P
2.5
2.0
1.5
1.0
0.5
P
P
S
OUT
D
0
D
, as in single-supply operation, the total drive power is
D
–55
= Quiescent Power + (Total Drive Power − Load Power)
=
=
OUT
. If the rms signal levels are indeterminate, consider
–45 –35 –25 –15 –5
(
(
V
V
S
= V
LFCSP-16
S
×
×
I
I
S
S
S
/2.
) (
)
+
+
⎛
⎜
⎜
⎝
AMBIENT TEMPERATURE (°C)
V
V
2
S
R
JA
S
OUT
/
L
.
5
4
×
)
2
15 25 35 45 55 65 75 85 95 105 115
V
= V
R
OUT
LFCSP-8
L
ADA4850-1/ADA4850-2
S
).
S
/4 for R
⎞
⎟
⎟
⎠
–
L
V
referenced to −V
OUT
R
L
L
D
2
to midsupply.
) is the sum of the
JA
L
values are
is referenced
S
, the worst
125
JA
.
S
)