MCP6V03-E/SN Microchip Technology, MCP6V03-E/SN Datasheet
MCP6V03-E/SN
Specifications of MCP6V03-E/SN
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MCP6V03-E/SN Summary of contents
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... Easy to Use: - Rail-to-Rail Input/Output - Gain Bandwidth Product: 1.3 MHz (typical) - Unity Gain Stable - Available in Single and Dual - Single with Chip Select (CS): MCP6V03 • Extended Temperature Range: -40°C to +125°C Typical Applications • Portable Instrumentation • Sensor Conditioning • Temperature Measurement • ...
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... MCP6V01/2/3 Typical Application Circuit kΩ MCP6V01 Offset Voltage Correction for Power Driver DS22058C-page OUT MCP6XXX © 2008 Microchip Technology Inc. ...
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... TC 2: Figure 2-18 shows how V CMR © 2008 Microchip Technology Inc. † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of +1 ...
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... G = +2, 0.5V input overdrive 1. 5. µ GND / and Figure 1-6). Conditions tone = kHz 1. tone = kHz 5. within 50 µV of its final value step of 2V, IN within 50 µV of its final value /2, DD 90% point (Note 2) OUT and Figure 2-38 show both an IMD © 2008 Microchip Technology Inc. ...
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... Input Current, High I CSH CS Input High, GND Current per I SS amplifier I SS Amplifier Output Leakage, CS High I O_LEAK CS Dynamic Specifications (MCP6V03) CS Low to Amplifier Output Turn-on Time CS High to Amplifier Output High-Z t OFF Internal Hysteresis V HYST TABLE 1-4: TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: V ...
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... I SS (typical (typical MΩ (typical) FIGURE 1-4: Chip Select (MCP6V03). DS22058C-page 6 1.4 Test Circuits The circuits used for the DC and AC tests are shown in Figure 1-5 and 1.8V to 5.5V out as discussed in Section 4.3.8 “Supply Bypassing and Filtering” and µV F ...
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... Input Offset Voltage's Quadratic Temp Co (nV/° FIGURE 2-3: Input Offset Voltage Quadratic Temp Co. © 2008 Microchip Technology Inc. = +1.8V to 5.5V GND 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 FIGURE 2-4: Power Supply Voltage with V ...
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... FIGURE 2-11: 160 155 150 145 140 135 130 125 120 -50 FIGURE 2-12: Ambient Temperature / / OUT DD 1/PSRR (µV/V) PSRR 5. 1.8V DD 1/A (µV/ Open-Loop Gain 5. 1.8V DD PSRR CMRR - 100 125 Ambient Temperature (°C) CMRR and PSRR vs. © 2008 Microchip Technology Inc. ...
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... I B 800 600 400 200 -200 -400 Common Mode Input Voltage (V) FIGURE 2-15: Input Bias and Offset Currents vs. Common Mode Input Voltage with T = +125°C. A © 2008 Microchip Technology Inc. = +1.8V to 5.5V GND 1,000 V = 5.5V DD 100 - 100 125 25 35 FIGURE 2-16: Currents vs ...
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... Power Supply Voltage (V) Output Short Circuit Current +125°C +85°C +25°C -40°C Power Supply Voltage (V) Supply Current vs. Power = +25°C POR Trip Voltage (V) Power On Reset Trip © 2008 Microchip Technology Inc. ...
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... Note: Unless otherwise indicated +25° / kΩ pF, and CS = GND 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 - Ambient Temperature (°C) FIGURE 2-24: Power On Reset Voltage vs. Ambient Temperature. © 2008 Microchip Technology Inc. = +1.8V to 5.5V GND 100 125 MCP6V01 OUT DD DS22058C-page 11 ...
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... V = 5.5V GBWP DD 110 100 1. - 100 125 Ambient Temperature (°C) Gain Bandwidth Product 130 120 110 100 Common Mode Input Voltage (V) Gain Bandwidth Product 130 120 110 100 Output Voltage (V) Gain Bandwidth Product © 2008 Microchip Technology Inc. ...
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... DD 1.E+03 1k 100 1.E+ V/V 10 1.E+ V 100 V/V 1 1.E+00 100k 1M 10M 1.0E+05 1.0E+06 1.0E+07 Frequency (Hz) FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with V DD © 2008 Microchip Technology Inc. = +1.8V to 5.5V GND 100 100M 100k 1.0E+08 1.E+05 FIGURE 2-33: = 1.8V. Separation vs. Frequency ...
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... DD P-P 1 kHz tone 10k 100k 1.E+03 1.E+04 1.E+05 Frequency (Hz) Inter-Modulation Distortion Disturbance (see DD NPBW = 10 Hz NPBW = 100 t (s) Input Noise vs. Time with =1.8V. DD NPBW = 10 Hz NPBW = 100 t (s) Input Noise vs. Time with =5.5V. DD © 2008 Microchip Technology Inc. ...
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... Time (200 µs/div) FIGURE 2-42: Input Offset Voltage vs. Time at Power Up OUT Time (ms) FIGURE 2-43: The MCP6V01/2/3 family shows no input phase reversal with overdrive. © 2008 Microchip Technology Inc. = +1.8V to 5.5V GND FIGURE 2-44: Step Response. 5.5 5.0 5.0 4.5 4.5 4.0 4.0 3.5 3 ...
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... ODR 100 125 FIGURE 2-50: Time vs. Inverting Gain / / OUT OUT 5.5V OUT -100 V/V 0 0.5V Overdrive -1 Time (50 µs/div) Output Overdrive Recovery low ODR 10 100 1000 Inverting Gain Magnitude (V/V) Output Overdrive Recovery © 2008 Microchip Technology Inc. ...
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... Note: Unless otherwise indicated / kΩ pF, and CS = GND 2.6 Chip Select Response (MCP6V03 only) 1.3 1 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.5 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) FIGURE 2-51: Chip Select Current vs. ...
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... FIGURE 2-61: Shutdown vs. Power Supply Voltage. 75 100 125 = OUT 100 125 Ambient Temperature (°C) Chip Select’s Pull-down ) vs. Ambient Temperature. DD +125°C +85°C +25°C -40°C Power Supply Voltage (V) Quiescent Current in © 2008 Microchip Technology Inc. ...
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... NC — 9 — 3.4 Chip Select (CS) Digital Input This pin (CS CMOS, Schmitt-triggered input that places the MCP6V03 op amps into a low power mode of operation. 3.5 Exposed Thermal Pad (EP –, … There is an internal connection between the Exposed Thermal Pad (EP) and the V nected to the same potential on the Printed Circuit Board (PCB) ...
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... MCP6V01/2/3 NOTES: DS22058C-page 20 © 2008 Microchip Technology Inc. ...
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... The clock is derived from an internal R-C oscillator running at a rate 300 kHz. The oscillator’s OSC1 output is divided down to the desired rate also randomized to minimize (spread) undesired clock tones in the output. © 2008 Microchip Technology Inc. MCP6V01/2/3 4.1 Overview of Auto-zeroing Operation Figure 4-1 shows a simplified diagram of the MCP6V01/2/3 auto-zeroed op amps ...
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... See ) and very low offset OL Output V OUT Buffer /ΔT ), 1/f noise, and input offset OS A Output V OUT Buffer Figure 2-37 and Figure 2-38. © 2008 Microchip Technology Inc. ...
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... These op amps are designed to drive light loads; use another amplifier to buffer the output from heavy loads. 4.2.3 CHIP SELECT (CS) The single MCP6V03 has a Chip Select (CS) pin. When CS is pulled high, the supply current for the corresponding op amp drops to about 1 µA (typical), and is pulled through the CS pin to V happens, the amplifier is put into a high impedance state ...
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... FIGURE 4-7: for Capacitive Loads. in Figure 4-6) ISO R ISO V OUT C L MCP6V0X Output Resistor ISO values for ISO G < 10p 100p 1n 10n 100n 1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 C (F) L Recommended R values ISO © 2008 Microchip Technology Inc. ...
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... C F 0.1 µF FIGURE 4-9: One Solution To Output Load Issue. © 2008 Microchip Technology Inc. 4.3.7 REDUCING UNDESIRED NOISE AND SIGNALS Reduce undesired noise and signals with: • Low bandwidth signal filters: - Minimizes random analog noise - Reduces interfering signals • ...
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... P M magnitude V is neglected MCP6V01 FIGURE 4-11: PCB Layout and Schematic for Single Non-inverting and Inverting Amplifiers. Note: Changing the orientation of the resistors will usually cause a significant decrease in the cancellation of the thermal voltages. © 2008 Microchip Technology Inc. V OUT V OUT ...
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... PCB Layout and Schematic for Single Difference Amplifier. Note: Changing the orientation of the resistors will usually cause a significant decrease in the cancellation of the thermal voltages. © 2008 Microchip Technology Inc. 4.3.9.4 Dual Non-inverting Amplifier Layout for Thermo-junctions The dual op amp amplifiers shown in and ...
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... Use more appropriate capacitor types in the signal path and minimize mechanical stresses and vibration. Humidity can cause electro-chemical potential voltages to appear in a circuit. Proper PCB cleaning helps, as does the use of encapsulants. © 2008 Microchip Technology Inc. ...
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... FIGURE 4-16: High Performance Design. © 2008 Microchip Technology Inc. 4.4.2 RTD SENSOR The ratiometric circuit in wire RTD. It corrects for the sensor’s wiring resistance by subtracting the voltage across the middle R top R1 does not change the output voltage; it balances the op amp inputs ...
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... would produce a Theve 1.00V and 250(R ). The TH resistor (in Figure 4-18), producing the ® can be used and C integrate 2 2 and OUT MCP6XXX 3 kΩ MCP6V01 Offset Correction. correction circuitry does OS MCP6V01 kΩ OUT MCP6541 Precision Comparator. © 2008 Microchip Technology Inc. ...
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... Helpful links are also provided for Data sheets, Purchase and Sampling of Microchip parts. © 2008 Microchip Technology Inc. MCP6V01/2/3 5.5 Analog Demonstration and Evaluation Boards ...
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... MCP6V01/2/3 NOTES: DS22058C-page 32 © 2008 Microchip Technology Inc. ...
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... Package Marking Information 8-Lead DFN (4x4) (MCP6V02) XXXXXX XXXXXX YYWW NNN 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN 8-Lead TDFN (2x3) (MCP6V01, MCP6V03) XXX YWW NN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘ ...
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... MCP6V01/2 NOTE 1 TOP VIEW A3 DS22058C-page EXPOSED PAD 2 D2 BOTTOM VIEW A A1 NOTE NOTE 1 © 2008 Microchip Technology Inc. ...
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... N NOTE © 2008 Microchip Technology Inc φ MCP6V01/2/3 α c β DS22058C-page 35 ...
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... MCP6V01/2/3 DS22058C-page 36 © 2008 Microchip Technology Inc. ...
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... Microchip Technology Inc. MCP6V01/2/3 DS22058C-page 37 ...
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... MCP6V01/2/3 DS22058C-page 38 © 2008 Microchip Technology Inc. ...
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... APPENDIX A: REVISION HISTORY Revision C (December 2008) The following is the list of modifications: 1. Added the 8-lead, 2x3 TDFN package for the MCP6V01 and MCP6V03 devices. 2. Corrected the IMD specification in Table 1-2. 3. Added 8-lead, 2x3 TDFN package information to Thermal Characteristic table. 4. Added information on the Exposed Thermal Pad (EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4 DFN packages ...
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... CMRR 106 — 1.8V CMRR 116 — 5.5V 114 — 1.8V 122 — 5.5V Table B-1. = GND / 1-6). Conditions = -0.2V to 2.0V (Note -0.2V to 5.7V (Note 0.2V to 1.6V (Note 1) OUT = 0.2V to 5.3V (Note 1) OUT © 2008 Microchip Technology Inc. ...
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... MCP6V01T-E/SN: Extended temperature, 8LD SOIC package. b) MCP6V01-E/MNY:Extended temperature, 8LD 2x3 TDFN package. a) MCP6V02-E/MD: Extended temperature, 8LD 4x4 DFN package. b) MCP6V02T-E/SN: Tape and Reel, Extended temperature, 8LD SOIC package. a) MCP6V03-E/SN: Extended temperature, 8LD SOIC package. b) MCP6V03-E/MNY:Extended temperature, 8LD 2x3 TDFN package. DS22058C-page 43 ...
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... MCP6V01/2/3 NOTES: DS22058C-page 44 © 2008 Microchip Technology Inc. ...
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... PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2008 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...