MCP6282-E/P Microchip Technology, MCP6282-E/P Datasheet - Page 24

• Manufacturer Part Number: MCP6282-E/P
• Description: IC OPAMP 2.2V DUAL R-R 8DIP
• Manufacturer: Microchip Technology

Specifications of MCP6282-E/P

• Slew Rate: 2.5 V/µs
• Package / Case: 8-DIP (0.300", 7.62mm)
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 5MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 3000µV
• Current - Supply: 450µA
• Current - Output / Channel: 25mA
• Voltage - Supply, Single/dual (±): 2.2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 70 dB
• Input Offset Voltage: 3 mV
• Input Bias Current (max): 1 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.2 V
• Technology: CMOS
• Voltage Gain Db: 110 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP6282-E/PR; MCP6282-E/PR

MCP6281/1R/2/3/4/5
DS21811E-page 24
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
N
1
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
b
e
L
c
A2
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
© 2008 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–