MC34072PG ON Semiconductor, MC34072PG Datasheet - Page 22

IC OPAMP DUAL SGL SUPP HS 8DIP

MC34072PG

Manufacturer Part Number
MC34072PG
Description
IC OPAMP DUAL SGL SUPP HS 8DIP
Manufacturer
ON Semiconductor
Datasheets

Specifications of MC34072PG

Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
13 V/µs
Gain Bandwidth Product
4.5MHz
Current - Input Bias
100nA
Voltage - Input Offset
1000µV
Current - Supply
1.9mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 44 V, ±1.5 V ~ 22 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Number Of Channels
2
Common Mode Rejection Ratio (min)
70 dB
Input Voltage Range (max)
Positive Rail - 1.8 V
Input Voltage Range (min)
Negative Rail
Input Offset Voltage
5 mV
Input Bias Current (max)
500 nA
Operating Supply Voltage
44 V
Supply Current
3.8 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage
+/- 22 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
Through Hole
Shutdown
No
Supply Voltage (max)
44 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Bandwidth
4.5 MHz
Channel Separation
120
Common Mode Rejection Ratio
97
Current, Input Bias
700 nA
Current, Input Offset
300 nA
Current, Output
30 mA
Current, Supply
2.8 mA
Harmonic Distortion
0.02 %
Number Of Amplifiers
Dual
Package Type
PDIP-8
Resistance, Input
150 Megohms
Temperature, Operating, Range
0 to +70 °C
Voltage, Gain
20 V/mV
Voltage, Input
±15 V
Voltage, Noise
32 nV/sqrt Hz
Voltage, Offset
7 mV
Voltage, Output, High
13.4 V
Voltage, Output, Low
-13.5 V
Voltage, Supply
3 to 44 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC34072PGOS
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
1
PACKAGE DIMENSIONS
B
1.26
T
H
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
22
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_

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