MC33078DG ON Semiconductor, MC33078DG Datasheet - Page 12
MC33078DG
Manufacturer Part Number
MC33078DG
Description
IC OPAMP DUAL LOW NOISE 8SOIC
Manufacturer
ON Semiconductor
Datasheet
1.MC33078DG.pdf
(14 pages)
Specifications of MC33078DG
Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
7 V/µs
Gain Bandwidth Product
16MHz
Current - Input Bias
300nA
Voltage - Input Offset
150µV
Current - Supply
4.1mA
Current - Output / Channel
37mA
Voltage - Supply, Single/dual (±)
10 V ~ 36 V, ±5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Number Of Channels
2
Common Mode Rejection Ratio (min)
80 dB
Input Voltage Range (max)
Positive Rail - 2 V
Input Voltage Range (min)
Negative Rail + 2 V
Input Offset Voltage
2 mV
Input Bias Current (max)
750 nA
Operating Supply Voltage
+/- 18 V
Supply Current
4.1 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 9 V, +/- 12 V, +/- 15 V
Maximum Dual Supply Voltage
+/- 18 V
Minimum Dual Supply Voltage
+/- 5 V
Mounting Style
SMD/SMT
Shutdown
No
Technology
Bipolar
Voltage Gain Db
110 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33078DGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC33078DG
Manufacturer:
ON Semiconductor
Quantity:
135
Company:
Part Number:
MC33078DG
Manufacturer:
ON Semiconductor
Quantity:
28
Part Number:
MC33078DG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33078DGKR
Manufacturer:
SEIKO
Quantity:
12 000
Company:
Part Number:
MC33078DGKR
Manufacturer:
Texas Instruments
Quantity:
25 000
Part Number:
MC33078DGKT
Manufacturer:
TI/德州仪器
Quantity:
20 000
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
*For additional information on our Pb−Free strategy and soldering
Y
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
Y
http://onsemi.com
M
N
CASE 751−07
SOIC−8 NB
X 45
ISSUE AH
_
M
12
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_