LM2902NG ON Semiconductor, LM2902NG Datasheet - Page 14

• Manufacturer Part Number: LM2902NG
• Description: IC OPAMP QUAD SGL SUPPLY 14DIP
• Manufacturer: ON Semiconductor

Specifications of LM2902NG

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 0.6 V/µs
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 2000µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 3 V ~ 32 V, ±1.5 V ~ 16 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Number Of Channels: 4
• Common Mode Rejection Ratio (min): 50 dB
• Input Voltage Range (max): Positive Rail - 5.7 V
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 7 mV
• Input Bias Current (max): 250 nA
• Output Current (typ): 40 mA
• Operating Supply Voltage: 32 V
• Supply Current: 1.2 mA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V, +/- 9 V
• Maximum Dual Supply Voltage: +/- 16 V
• Minimum Dual Supply Voltage: +/- 1.5 V
• Mounting Style: Through Hole
• Shutdown: No
• Supply Voltage (max): 32 V
• Supply Voltage (min): 3 V
• Technology: Bipolar
• Voltage Gain Db: 100 dB
• Bandwidth: 1 MHz
• Channel Separation: -120
• Common Mode Rejection Ratio: 70
• Current, Input Bias: -500 nA
• Current, Input Offset: 200 nA
• Current, Output: 40 mA
• Current, Supply: 3 mA
• Number Of Amplifiers: Quad
• Package Type: PDIP-14
• Temperature, Operating, Range: -40 to +105 °C
• Voltage, Gain: 15 V/mV
• Voltage, Input: -0.3 to 32 VDC
• Voltage, Offset: 10 mV
• Voltage, Output, High: 3.5 V
• Voltage, Output, Low: 5 mV
• Voltage, Supply: 3 to 32 VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: LM2902NGOS

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
14
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
0.65
PITCH
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_