OP281GSZ Analog Devices Inc, OP281GSZ Datasheet - Page 14

• Manufacturer Part Number: OP281GSZ
• Description: IC OPAMP GP R-R 105KHZ LP 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of OP281GSZ

• Slew Rate: 0.028 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 105kHz
• Current - Input Bias: 3nA
• Voltage - Input Offset: 100µV
• Current - Supply: 3.3µA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ±1.35 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Low Power
• No. Of Amplifiers: 2
• Bandwidth: 105kHz
• Supply Voltage Range: 2.7V To 12V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OP281/OP481
COPLANARITY
0.25 (0.0098)
0.10 (0.0040)
8-Lead Thin Shrink Small Outline Package [TSSOP]
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
4.00 (0.1574)
3.80 (0.1497)
8-Lead Standard Small Outline Package [SOIC]
0.10
COPLANARITY
0.15
0.05
PIN 1
0.10
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MS-012AA
COMPLIANT TO JEDEC STANDARDS MO-153AA
SEATING
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
PLANE
8
1
8
Dimensions shown in millimeters
1
0.65
BSC
3.10
3.00
2.90
BSC
0.30
0.19
5
4
5
4
0.51 (0.0201)
0.33 (0.0130)
SEATING
PLANE
Narrow Body
6.20 (0.2440)
5.80 (0.2284)
1.20
MAX
4.50
4.40
4.30
1.75 (0.0688)
1.35 (0.0532)
(RU-8)
(R-8)
6.40 BSC
0.20
0.09
0.25 (0.0098)
0.19 (0.0075)
8
0
8
0
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.41 (0.0160)
OUTLINE DIMENSIONS
0.75
0.60
0.45
45
–14–
0.25 (0.0098)
0.10 (0.0039)
1.05
1.00
0.80
4.00 (0.1575)
3.80 (0.1496)
COPLANARITY
14-Lead Thin Shrink Small Outline Package [TSSOP]
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
4.50
4.40
4.30
PIN 1
14-Lead Standard Small Outline Package [SOIC]
0.10
0.15
0.05
14
1
Dimensions shown in millimeters and (inches)
BSC
0.65
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
14
1
COMPLIANT TO JEDEC STANDARDS MS-012AB
1.27 (0.0500)
0.30
0.19
8.75 (0.3445)
8.55 (0.3366)
5.10
5.00
4.90
0.51 (0.0201)
0.33 (0.0130)
BSC
Dimensions shown in millimeters
SEATING
PLANE
8
7
Narrow Body
8
7
BSC
6.40
1.20
MAX
(RU-14)
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
(R-14)
COPLANARITY
1.75 (0.0689)
1.35 (0.0531)
0.20
0.09
0.10
0.25 (0.0098)
0.19 (0.0075)
8
0
8
0
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
REV. B
0.75
0.60
0.45
45