AD8642ARZ Analog Devices Inc, AD8642ARZ Datasheet - Page 5

• Manufacturer Part Number: AD8642ARZ
• Description: IC OPAMP JFET R-R 3.5MHZ 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8642ARZ

• Slew Rate: 3 V/µs
• Amplifier Type: J-FET
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 3.5MHz
• Current - Input Bias: 0.25pA
• Voltage - Input Offset: 70µV
• Current - Supply: 200µA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/dual (±): 5 V ~ 26 V, ±2.5 V ~ 13 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Precision
• No. Of Amplifiers: 2
• Bandwidth: 3.5MHz
• Supply Voltage Range: 5V To 26V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
KS-5, R-8, RM-8, R-14, CP-16 Packages
KS-5, R-8, RM-8, R-14, CP-16 Packages
Rating
27.3 V
VS− to VS+
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
±Supply Voltage
300°C
Rev. C | Page 5 of 16
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. This
was measured using a standard 4-layer board. For the LFCSP
package, the exposed pad should be soldered to a copper plane
that may be connected to V− or to ground.
Table 4.
Package Type
5-Lead SC70 (KS)
8-Lead SOIC (R)
8-Lead MSOP (RM)
14-Lead SOIC (R)
16-Lead LFCSP (CP)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
AD8641/AD8642/AD8643
θ
430
121
142
110
81
JA
θ
149
43
45
36
16
JC
Unit
°C/W
°C/W
°C/W
°C/W
°C/W