OP293FSZ Analog Devices Inc, OP293FSZ Datasheet - Page 8

IC OPAMP GP 35KHZ DUAL 8SOIC

OP293FSZ

Manufacturer Part Number
OP293FSZ
Description
IC OPAMP GP 35KHZ DUAL 8SOIC
Manufacturer
Analog Devices Inc
Type
General Purpose Amplifierr
Datasheets

Specifications of OP293FSZ

Slew Rate
0.015 V/µs
Design Resources
4 mA-to-20 mA Loop-Powered Temperature Monitor Using ADuC7060/1 (CN0145)
Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Gain Bandwidth Product
35kHz
Current - Input Bias
20nA
Voltage - Input Offset
250µV
Current - Supply
30µA
Current - Output / Channel
25mA
Voltage - Supply, Single/dual (±)
1.7 V ~ 36 V, ±0.85 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
Precision
No. Of Amplifiers
2
Bandwidth
35kHz
Supply Voltage Range
2V To ± 18V
Amplifier Case Style
SOIC
No. Of Pins
8
Rail/rail I/o Type
No
Number Of Elements
2
Unity Gain Bandwidth Product
0.035MHz
Common Mode Rejection Ratio
96dB
Input Offset Voltage
250uV
Input Bias Current
20nA
Single Supply Voltage (typ)
3/5/9/12/15/18/24/28V
Voltage Gain In Db
106.02dB
Power Supply Rejection Ratio
97dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
2V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±1V
Dual Supply Voltage (max)
±18V
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
Compliant

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OP193/OP293
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
For supply voltages less than ±18 V, the input voltage is limited to the
supply voltage.
1
1
1
Rating
±18 V
±18 V
±18 V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
Rev. C | Page 8 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
8-Lead SOIC_N (S)
1
ESD CAUTION
θ
soldered in a circuit board for the SOIC package.
JA
JA
is specified for the worst-case conditions, that is, a device
is specified for the worst-case conditions. θ
θ
158
JA
1
JA
is specified for a device
θ
43
JC
Unit
°C/W

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