OP262GSZ Analog Devices Inc, OP262GSZ Datasheet - Page 19

• Manufacturer Part Number: OP262GSZ
• Description: IC OPAMP GP R-R 15MHZ DUAL 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of OP262GSZ

• Slew Rate: 13 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 15MHz
• Current - Input Bias: 260nA
• Voltage - Input Offset: 25µV
• Current - Supply: 550µA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ±1.35 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Low Offset Voltage
• No. Of Amplifiers: 2
• Bandwidth: 15MHz
• Supply Voltage Range: 2.7V To 12V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OUTLINE DIMENSIONS
COPLANARITY
Figure 51. 8-Lead Standard Small Outline Package [SOIC] Narrow Body
0.25 (0.0098)
0.10 (0.0040)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.15
0.00
4.00 (0.1574)
3.80 (0.1497)
COPLANARITY
Figure 53. 8-Lead Thin Shrink Small Outline Package [TSSOP)
0.10
COPLANARITY
BSC
3.00
0.15
0.05
PIN 1
Figure 52. 8-Lead Mini Small Outline Package [MSOP]
0.10
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-012AA
Dimensions shown in millimeters and (inches)
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
COMPLIANT TO JEDEC STANDARDS MO-153AA
0.38
0.22
8
1
0.65 BSC
SEATING
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
BSC
3.00
8
0.65 BSC
1
PLANE
8
Dimensions shown in millimeters
1
Dimensions shown in millimeters
3.10
3.00
2.90
BSC
0.30
0.19
5
4
5
4
SEATING
PLANE
5
4
0.51 (0.0201)
0.31 (0.0122)
BSC
SEATING
PLANE
4.90
6.20 (0.2440)
5.80 (0.2284)
1.10 MAX
S-Suffix (R-8)
1.20
MAX
4.50
4.40
4.30
1.75 (0.0688)
1.35 (0.0532)
(RM-8)
(RU-8)
0.23
0.08
6.40 BSC
0.20
0.09
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
8°
0°
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
0.80
0.60
0.40
× 45°
Rev. F | Page 19 of 20
COPLANARITY
0.25 (0.0098)
0.10 (0.0039)
1.05
1.00
0.80
Figure 55. 14-Lead Standard Small Outline Package [SOIC] Narrow Body
4.00 (0.1575)
3.80 (0.1496)
4.50
4.40
4.30
PIN 1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.10
Figure 54. 14-Lead Thin Shrink Small Outline Package [TSSOP]
0.15
0.05
14
1
BSC
0.65
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Dimensions shown in millimeters and (inches)
14
1
COMPLIANT TO JEDEC STANDARDS MS-012AB
1.27 (0.0500)
0.30
0.19
5.10
5.00
4.90
8.75 (0.3445)
8.55 (0.3366)
BSC
0.51 (0.0201)
0.31 (0.0122)
Dimensions shown in millimeters
8
7
SEATING
PLANE
BSC
6.40
8
7
S-Suffix (R-14)
1.20
MAX
6.20 (0.2441)
5.80 (0.2283)
(RU-14)
SEATING
PLANE
COPLANARITY
1.75 (0.0689)
1.35 (0.0531)
OP162/OP262/OP462
0.20
0.09
0.10
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
× 45°