AD8277ARZ Analog Devices Inc, AD8277ARZ Datasheet - Page 5

IC AMP GP UNITY GAIN DIFF 14SOIC

AD8277ARZ

Manufacturer Part Number
AD8277ARZ
Description
IC AMP GP UNITY GAIN DIFF 14SOIC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8277ARZ

Amplifier Type
Differential
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
1.1 V/µs
Gain Bandwidth Product
550kHz
Voltage - Input Offset
100µV
Current - Supply
200µA
Current - Output / Channel
15mA
Voltage - Supply, Single/dual (±)
2 V ~ 36 V, ±2 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
No. Of Amplifiers
2
Input Offset Voltage
500µV
Bandwidth
500kHz
Supply Voltage Range
2V To 36V
Supply Current
200µA
Amplifier Case Style
SOIC
No. Of Pins
14
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Current - Input Bias
-

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ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Maximum Voltage at Any Input Pin
Minimum Voltage at Any Input Pin
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (T
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The θ
board with zero airflow.
Table 5.
Package Type
8-Lead MSOP
8-Lead SOIC
14-Lead SOIC
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8276/AD8277
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the properties of the plastic change. Even temporarily
exceeding this temperature limit may change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a temperature of 150°C
for an extended period may result in a loss of functionality.
JA
values in Table 5 assume a 4-layer JEDEC standard
θ
135
121
105
JA
G
)
Unit
°C/W
°C/W
°C/W
Rating
±18 V
−V
+V
−65°C to +150°C
−40°C to +85°C
150°C
S
S
+ 40 V
− 40 V
J
) on
Rev. B | Page 5 of 20
SHORT-CIRCUIT CURRENT
The AD8276/AD8277 have built-in, short-circuit protection
that limits the output current (see Figure 25 for more information).
While the short-circuit condition itself does not damage the
part, the heat generated by the condition can cause the part to
exceed its maximum junction temperature, with corresponding
negative effects on reliability. Figure 3 and Figure 25, combined
with knowledge of the supply voltages and ambient temperature of
the part, can be used to determine whether a short circuit will
cause the part to exceed its maximum junction temperature.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
2.0
1.6
1.2
0.8
0.4
0
–50
–25
8-LEAD MSOP
θ
JA
= 135°C/W
0
AMBIENT TEMERATURE (°C)
14-LEAD SOIC
θ
JA
= 105°C/W
25
50
θ
8-LEAD SOIC
JA
AD8276/AD8277
= 121°C/W
T
J
75
MAX = 150°C
100
125

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