BU7261SG-TR Rohm Semiconductor, BU7261SG-TR Datasheet - Page 14

• Manufacturer Part Number: BU7261SG-TR
• Description: OP AMP I/O LV 1.8-5.5V 5-SSOP
• Manufacturer: Rohm Semiconductor

Specifications of BU7261SG-TR

• Slew Rate: 1.1 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 2MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 1000µV
• Current - Supply: 250µA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V, ±0.9 V ~ 2.75 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 5-SSOP
• Op Amp Type: CMOS
• No. Of Amplifiers: 1
• Bandwidth: 2MHz
• Supply Voltage Range: ± 0.9V To ± 2.75V
• Amplifier Case Style: SSOP
• No. Of Pins: 5
• Operating Temperature Range: -40°C To
• Number Of Channels: 1
• Voltage Gain Db: 95 dB
• Common Mode Rejection Ratio (min): 45 dB
• Input Offset Voltage: 9 mV
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 0.55 mA
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 2.75 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details

● Derating curve
P
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that can
be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power
dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of
package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the
storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in
the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the
package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance,
represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this thermal resistance.
Fig.6 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction
temperature Tj, and power dissipation Pd can be calculated by the equation below :
Derating curve in Fig.6 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance θja.
Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind
velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a
specified condition. Fig7(c)-(f) show a derating curve for an example of BU7261series, BU7262series, BU7241,BU7242series.
ower dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
When using the unit above Ta=25[ ℃ ], subtract the value above per degree[ ℃ ]. Permissible dissipation is the value
when FR4 glass epoxy board 70[mm] × 70[mm] × 1.6[mm] (cooper foil area below 3[ ％ ]) is mounted.
（*8）
5.4
（*9） （*10）
6.2
θja = ( Tj ー Ta ) / Pd [ ℃ /W]
800
600
400
200
(a) Thermal resistance
800
600
400
200
0
0
Chip surface temperature Tj [ ℃ ]
θja ＝ (Tj－Ta) / Pd
0
Ambient temperature Ta [ ℃ ]
0
(e) BU7261SG BU7241SG
Power dissipation P [W]
(c) BU7261G BU7241G
4.8
AMBIENT TEMPERATURE [ ℃ ]
AMBIENT TEMPERATURE [ ℃ ]
50
50
[mW/℃]
Unit
540[mw]
540[mw]
85
Fig.6 Thermal resistance and derating
100
100
BU7261G(*8)
BU7241G(*8)
BU7261SG(*8)
BU7241SG(*8)
105
[℃/W]
Fig.7 Derating Curve
150
150
14/16
・・・・・ （Ⅰ）
Power dissipation of LSI [W]
1000
1000
800
600
400
200
LSI の消費電力 [W]
P2
P1
800
600
400
200
(f) BU7262S F/FVM BU7242S F/FVM
(d) BU7262F/FVM BU7242F/FVM
0
0
0
0
Ambient temperature Ta [ ℃ ]
0
Pd(max)
周囲温度 Ta[ ℃ ]
(b) Derating curve
AMBIENT TEMPERATURE [ ℃ ]
25
AMBIENT TEMPERATURE [ ℃ ]
50
50
480[mw]
50
620[mw]
θja1
480[mw]
620[mw]
85
BU7262SFVM(*10)
BU7242SFVM(*10)
BU7262SF(*9)
BU7242SF(*9)
75
100
100
BU7262FVM(*10)
BU7242FVM(*10)
BU7262F(*9)
BU7242F(*9)
BU7261/BU7241
105
θja2
θja2 < θja1
Tj(max)
100
150
150
125
Tj(max)
150