LM2904MX Rohm Semiconductor, LM2904MX Datasheet - Page 8

IC OPAMP DUAL 26V 8-SOIC

LM2904MX

Manufacturer Part Number
LM2904MX
Description
IC OPAMP DUAL 26V 8-SOIC
Manufacturer
Rohm Semiconductor
Series
Nowr
Datasheets

Specifications of LM2904MX

Amplifier Type
General Purpose
Number Of Circuits
2
Current - Input Bias
45nA
Voltage - Input Offset
2000µV
Current - Supply
1mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
3 V ~ 26 V, ±1.5 V ~ 13 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
General Purpose
No. Of Amplifiers
2
Supply Voltage Range
± 1.5V To ± 16V
Amplifier Case Style
SOIC
No. Of Pins
8
Operating Temperature Range
-40°C To +125°C
Svhc
No SVHC (18-Jun-2010)
Number Of Channels
2
Voltage Gain Db
100 dB
Common Mode Rejection Ratio (min)
50 dB
Input Offset Voltage
7 mV
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V
Supply Current
1.2 mA
Maximum Power Dissipation
450 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Maximum Dual Supply Voltage
+/- 16 V
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Slew Rate
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
 Details
Other names
LM2904MXTR

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External Dimensions
Part Number Explanation
Specify the product by the part number
when placing orders.
Verify that the entire part number is correct.
Start with the leftmost space without leaving
any empty space between characters.
S.O Package8
S.O Package14
SOIC8
L M 3 5 8 M X
family name
Tape
Quantity
Direction
of feed
8/8
LM358
LM324
LM2904
LM2902
Under development
Pin 1 is at the upper left holding the reel with the left hand
while pulling the tape out with the right
Reel
2500pcs
Embossed carrier tape
Package type
M : S.O Package
MT : TSSOP
Please order in multiples of the minimum package quantity.
Pin 1
TSSOP14
TSSOP14
These Products are designed and produced by ROHM.
NOW SERIES LM2904/2902/358/324 family
Direction of feed
X : Reel
Under development

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