LT1801IMS8#PBF Linear Technology, LT1801IMS8#PBF Datasheet - Page 18

• Manufacturer Part Number: LT1801IMS8#PBF
• Description: IC OPAMP R-R IN/OUT DUAL 8-MSOP
• Manufacturer: Linear Technology

Specifications of LT1801IMS8#PBF

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 20 V/µs
• Gain Bandwidth Product: 70MHz
• Current - Input Bias: 400nA
• Voltage - Input Offset: 700µV
• Current - Supply: 1.8mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 2.3 V ~ 12.6 V, ±1.15 V ~ 6.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -

LT1801/LT1802
PACKAGE DESCRIPTION
18
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(.0165 ± .0015)
0.42 ± 0.038
GAUGE PLANE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
2.38 ±0.05
(2 SIDES)
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
(.010)
0.254
0.675 ±0.05
PACKAGE
OUTLINE
DETAIL “A”
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660 Rev F)
(Reference LTC DWG # 05-08-1698)
0° – 6° TYP
(.0256)
0.889 ± 0.127
TOP MARK
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
(NOTE 6)
8-Lead Plastic MSOP
(.021 ± .006)
0.53 ± 0.152
PIN 1
0.200 REF
DD Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MS8 Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
SEATING
PLANE
4.90 ± 0.152
(.193 ± .006)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
3.00 ±0.10
0.75 ±0.05
(.0256)
(4 SIDES)
0.65
BSC
1
8
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
0.52
0.86
0.1016 ± 0.0508
REF
REF
MSOP (MS8) 0307 REV F
(.004 ± .002)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD) DFN 1203
18012fc