SPUL409HE5H-PB Knowles Acoustics, SPUL409HE5H-PB Datasheet - Page 8

• Manufacturer Part Number: SPUL409HE5H-PB
• Description: MIC SISONIC SMD 1.5-3.6V MINI
• Manufacturer: Knowles Acoustics
• Series: SiSonic™r
• Type: MEMS (Silicon) - Analogr

Specifications of SPUL409HE5H-PB

• Sensitivity: -42dB ±3dB
• Voltage - Rated: 1.5 ~ 3.6V
• Current: 250µA
• Size / Dimension: Rectangular - 3.76mm L x 2.95mm W x 1.1mm H
• S/n Ratio: 59dB
• Impedance: 300 Ohm
• Termination: Surface Mount
• Direction: Omnidirectional
• Port Location: Top
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency: -
• Filter Type: -
• Other names: 423-1130-2; SPUL409HE5H; SPUL409HE5H; SPUL409HE5H-PB-2; SPUL409HE5H-PB

(A)
(B)
(C)
(D)
170–180° C
11. SOLDER REFLOW PROFILE
12. ADDITIONAL NOTES
Packaging (reference SiSonic_Packaging_Spec.pdf)
Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened
ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.
Exposure: Devices should not be exposed to high humidity, high temperature environment.
MSL (moisture sensitivity level) Class 2.
Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum
conditions of 30ºC/70% R.H.
Notes:
1.
2.
3.
Do not pull a vacuum over the port hole of the microphone. Pulling a
vacuum over the port hole can damage the device.
Do not board wash after the reflow process. Board washing and
cleaning agents can damage the device. Do not expose to ultrasonic
processing or cleaning.
Number of Reflow = recommend no more than 3 cycles.
Solder Melt
Pre-heat
Stage
Peak
Knowles Acoust ics, a division of Knowles
Pre-heat
120 sec.
230° C
Temperature Profile
Elect r onics, LLC.
260 C maximum
Above 230 C
170 ~ 180 C
SPUL409HE5H-PB
Solder Melt
100 sec.
Time (maximum)
120 sec.
100 sec.
30 sec.
Revision: C
260° C
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