MC9S08GT32CFDER Freescale Semiconductor, MC9S08GT32CFDER Datasheet - Page 285
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S08GT32CFDER
Manufacturer Part Number
MC9S08GT32CFDER
Description
IC MCU 32K FLASH 2K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.M68EVB908GB60E.pdf
(290 pages)
Specifications of MC9S08GT32CFDER
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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B.6
Freescale Semiconductor
SEATING
PLANE
-T-
42-Pin SDIP Package Drawing
42
1
D
F
0.25 (0.010)
42 PL
-A-
M
T
G
A
S
MC9S08GB/GT Data Sheet, Rev. 2.3
22
21
N
C
K
-B-
CASE 858-01
J
ISSUE O
42 PL
0.25 (0.010)
M
H
T
L
B
M
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
G
M
A
B
C
D
F
H
J
K
L
N
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0
42-Pin SDIP Package Drawing
INCHES
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
15
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
DATE 02/27/90
1.778 BSC
15.24 BSC
7.62 BSC
0
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
1.02
15
285
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