M306N5FCTFP Renesas Electronics America, M306N5FCTFP Datasheet - Page 60
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M306N5FCTFP
Manufacturer Part Number
M306N5FCTFP
Description
IC M16C MCU FLASH 100QFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/6Nr
Datasheets
1.M30622SAFPU5.pdf
(308 pages)
2.M306N5FCTFPUK.pdf
(90 pages)
3.M306N5FCTFPU0.pdf
(408 pages)
Specifications of M306N5FCTFP
Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
87
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M306N5FCTFP
Manufacturer:
ON
Quantity:
36 000
Company:
Part Number:
M306N5FCTFP#U0
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M306N5FCTFP#UK
Manufacturer:
XILINX
Quantity:
1 400
Company:
Part Number:
M306N5FCTFP#UK
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
M306N5FCTFP#UK
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M306N5FCTFP#UKJ
Manufacturer:
Renesas Electronics America
Quantity:
10 000
M16C/6N Group (M16C/6N5)
Rev.2.40
REJ03B0004-0240
Under development
This document is under development and its contents are subject to change.
NOTES:
Switching Characteristics
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
Table 5.48 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
d(BCLK-AD)
h(BCLK-AD)
h(RD-AD)
h(WR-AD)
d(BCLK-CS)
h(BCLK-CS)
d(BCLK-ALE)
h(BCLK-ALE)
d(BCLK-RD)
h(BCLK-RD)
d(BCLK-WR)
h(BCLK-WR)
d(BCLK-DB)
h(BCLK-DB)
d(DB-WR)
h(WR-DB)
d(BCLK-HLDA)
Symbol
1. Calculated according to the BCLK frequency as follows:
2. Calculated according to the BCLK frequency as follows:
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – V
by a circuit of the right figure.
For example, when V
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 V
Aug 25, 2006
0.5 ✕ 10
f(BCLK)
0.5 ✕ 10
f(BCLK)
Address output delay time
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
Address output hold time (in relation to WR)
Chip select output delay time
Chip select output hold time (in relation to BCLK)
ALE signal output delay time
ALE signal output hold time
RD signal output delay time
RD signal output hold time
WR signal output delay time
WR signal output hold time
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
Data output delay time (in relation to WR)
Data output hold time (in relation to WR)
__________
HLDA output delay time
9
9
– 10 [ns]
– 40 [ns]
page 58 of 84
OL
OL
/ V
= 0.2 V
CC
Parameter
f(BCLK) is 12.5 MHz or less.
)
CC
/ V
CC
, C = 30 pF,
CC
) = 6.7 ns.
(3)
(3)
Figure 5.12 Port P0 to P10 Measurement Circuit
Figure 5.12
Measuring
Condition
5. Electric Characteristics (Normal-ver.)
DBi
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
(NOTE 1)
(NOTE 2)
(NOTE 1)
Min.
–4
4
0
4
0
0
4
Standard
R
C
30 pF
Max.
VCC = 5 V
25
25
15
25
25
40
40
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns