M30803FGFP#D3 Renesas Electronics America, M30803FGFP#D3 Datasheet - Page 167
M30803FGFP#D3
Manufacturer Part Number
M30803FGFP#D3
Description
IC M16C MCU FLASH 256K 100LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/80r
Datasheet
1.M30803FGGPU3.pdf
(360 pages)
Specifications of M30803FGFP#D3
Core Processor
M16C/80
Core Size
16-Bit
Speed
20MHz
Connectivity
SIO, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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M
R
R
e
E
1
v
J
6
Figure 19.4 Connecting the SIM interface
1 .
0
C
9
0 .
8 /
B
Figure 19.4 shows the example of connecting the SIM interface. Connect TxDi and RxDi and apply pull-
up.
0
0
0
1
A
8
G
u
7
o r
. g
0 -
u
1
0
p
0
, 2
0
2
Note :TxDi pin is N-channel open drain and needs a pull-up resistance.
0
0
5
Page 154
19. Clock-asynchronous serial I/O mode (compliant with the SIM interface)
Microcomputer
f o
RxD
TxD
3
2
9
i
i
(Note)
SIM card
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